2022
DOI: 10.1038/s41598-022-06965-3
|View full text |Cite
|
Sign up to set email alerts
|

High-precision micro-displacement sensor based on tunnel magneto-resistance effect

Abstract: A high-precision micro-displacement sensor based on tunnel magneto-resistance effect is reported.We designed and simulated magnetic characteristics of the sensor, and employed chip-level Au-In bonding to implement low-temperature assembly of the TMR devices. We employed the subdivision interpolation technique to enhance the resolution by translating the sine-cosine outputs of a TMR sensor into an output that varies linearly with the displacement. Simultaneously, using the multi-bridge circuit method to suppres… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2022
2022
2024
2024

Publication Types

Select...
5

Relationship

1
4

Authors

Journals

citations
Cited by 5 publications
(1 citation statement)
references
References 30 publications
0
1
0
Order By: Relevance
“…In Fig. 10d, springs and proof mass are fabricated by using back-sided deep reactive ion etching (DRIE) technique, which can keep the gap between proof mass and frame less than 10 µ m. This design solves the incompatibility in geometries between MEMS structure and silicon nanowaveguides with reasonable aspect ratio in fabrication [32][33][34] .…”
Section: Design Of the Mechanical Partmentioning
confidence: 99%
“…In Fig. 10d, springs and proof mass are fabricated by using back-sided deep reactive ion etching (DRIE) technique, which can keep the gap between proof mass and frame less than 10 µ m. This design solves the incompatibility in geometries between MEMS structure and silicon nanowaveguides with reasonable aspect ratio in fabrication [32][33][34] .…”
Section: Design Of the Mechanical Partmentioning
confidence: 99%