High-Precision Thickness Measurement of Cu Film on Si-Based Wafer Using Erasable Printed Eddy Current Coil and High-Sensitivity Associated Circuit Techniques

Qu, Zilian; Wang, Wensong; Yang, Zhengchun; Bao, Qiwen; Zheng, Yuanjin

doi:10.1109/tie.2021.3111570

Cited by 9 publications

(1 citation statement)

References 23 publications

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“…Moreover, the eddy current method is also widely used in the industry. In recent years, eddy current technology has been used to measure the thickness of metal film [15,16]. It has many advantages such as low cost, high sensitivity, a large measurement range, and insensitivity to contaminants.…”

Section: Introductionmentioning

confidence: 99%

Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing

Tian,

Wang,

2023

Micromachines

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Endpoint detection is an important technology in chemical mechanical polishing (CMP), which is used to capture the material interface and compensate the variations of consumables and incoming wafer thickness. This paper aimed to apply optical detection in metal CMP. An in situ optical measurement system was developed for a 12-inch CMP tool. Kinematic analysis of the scanning trajectory of the laser device indicated the relative position relationship between the device and the wafer. Average optical data within the wafer described the material removal of metal CMP. Furthermore, optical data and location described the non-uniformity of the entire wafer surface. In this research, the polishing condition and the residual of the wafer edge are characterized by optical trace. Pauta Criterion is used to discriminate the inflexion point of the material interface. The results reveal that the interface capture is accurate and effective.

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Section: Introductionmentioning

confidence: 99%