The formation of silicon dioxide (SiO 2 ) layers at low temperatures (150-400 1C) by atmospheric pressure plasma oxidation of Si(0 0 1) wafers have been studied using a gas mixture containing He and O 2 . A 150 MHz very high frequency (VHF) power supply was used to generate high-density atomic oxygen in the atmospheric pressure plasma. Oxidation rate, structure, and thickness and refractive index profiles of the oxidized layers were investigated by ellipsometry and infrared absorption spectroscopy. Atomic force microscopy was also employed to observe atomic-scale morphologies of the layer surface and wafer Si surface, after chemical removal of the oxidized layers. It was found that stoichiometric SiO 2 layers were obtained at higher oxidation rates than conventional dry O 2 thermal oxidation and radical oxidation processes, even at a very low substrate temperature of 150 1C. Although thickness variations were observed in the plasma region, the refractive index was independent of both substrate temperature and VHF power. In addition, the SiO 2 surface and SiO 2 /Si interface roughnesses were comparable to those obtained in conventional dry oxidation at high temperatures. r