High rate deposition of thick CrN and Cr2N coatings using modulated pulse power (MPP) magnetron sputtering

Hybrid HIPIMS and DC magnetron sputtering deposition of TiN coatings: Deposition rate, structure and tribological properties

“…The residual stress was substantially lower than the DC magnetron sputtered TiN. The lower residual stress agrees well to the results of other researchers [16][17][18][19] . In addition, it should be pointed out that, the hardness values measured by indentation are related to the residual stress of the coatings.…”

“…Recently efforts have been made to increase the deposition rates of the HIPIMS process by either adjusting the HIPIMS power input to moderate levels [16][17] , developing a hybrid deposition process [18][19][20] , or varying the magnetic field [16,[21][22] . In the first approach [16][17] , the main differences between the HIPIMS (or HPPMS) and the modulated pulse power (MPP) technique include the magnitude, duration, and shape of the high power pulse.…”

“…In the first approach [16][17] , the main differences between the HIPIMS (or HPPMS) and the modulated pulse power (MPP) technique include the magnitude, duration, and shape of the high power pulse. The density of the pulse power was moderated typically to 0.5 -1.5 kW⋅cm -2 as compared to 1.0 -3.0 kW⋅cm -2 in the HPPMS process, whereas the pulse length was significantly prolonged up to 3,000 µs as compared to 100 -150 µs in the HPPMS process.…”

“…The MPP technique provides a controlled low ion energy and high metal-ion flux for the deposition of dense coatings with good adhesion property. Moreover, this technique has also demonstrated its potential in the deposition of thick metal nitride coatings with dense nano-columnar structure and controlled low compressive residual stresses [17] . In the second approach, a HIPIMS power supply has been introduced to a multi-target deposition system to combine with another deposition technique having higher deposition rates, e.g.…”

Study of magnetic iron nitride thin films deposited by high power impulse magnetron sputtering

“…Moreover, due to high metal ionization this technique has a better scope for controlling film properties deposited via reactive sputtering. As such HiPIMS has been frequently utilized for the deposition of metal nitrides such as Al-N, [6] Cr-N, [7][8][9] Ti-N, [10] Nb-N, [11] etc. and metal oxide thin films such as TiO 2 , [12,13] Al 2 O 3 , [14,15] ZnO, [16] ZrO 2 , [17] and Fe 2 O 3 .…”