High Resolution 3D Microstructures Made by Localized Electrodeposition of Nickel

Jansson, Anders; Thornell, Greger; Johansson, Stefan

doi:10.1149/1.1393439

Cited by 73 publications

(51 citation statements)

References 9 publications

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“…25,26 In localized electrodeposition, a sharp counter electrode is brought close to a conducting, semi-infinite, planar substrate in an electro- lyte. A potential is applied across the two electrodes.…”

Section: Discussionmentioning

confidence: 99%

Microelectroplating Silver on Sharp Edges toward the Fabrication of Solid-State Nanopores

Polk

Bernard

Kasianowicz

et al. 2004

J. Electrochem. Soc.

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Electrodeposition of silver was investigated as a fabrication tool for constricting large (10 3 m 2 ) vias in silicon substrates while leaving a small opening in the center of the via. Silver reduction from ammoniacal silver nitrate was studied at electrodes of novel geometry, i.e., the edge of the vias, with respect to reduction potential, reduction pulse type, and pulse duration. A variety of crystal nucleation and growth patterns were observed and characterized by scanning electron microscopy. It was found that electroplated silver occluded the vias to leave open areas of less than 1 m 2 . Such occlusions might be used as restrictions in microfluidics systems, forming a type of solid-state micropore or nanopore.Electrodeposition of metals on patterned surfaces has been of interest for a number of applications including the deposition of interconnecting elements used in integrated circuits, microelectromechanical systems ͑MEMS͒ and LIGA ͑lithographic-galvanoformung-abformung, or lithography-electroplating-molding͒ processes to name examples. 1-3 In most of these applications, the goal has been to use electrodeposition to completely fill a feature that is patterned on a surface. Filling in surface features such that the deposited metal conforms to all surfaces of high-aspect-ratio topography is challenging and often requires complicated chemistry and experimental techniques. 4 The work reported here is to create a structure by use of electrodeposition to constrict a micrometer-sized opening to submicrometer size. The challenge is to attain precise control of the restriction size during electrodeposition. There have been reports of using templated electroless metal plating for partially filling in track etched membrane filters. 5 However, one feature of the templated method is it produces many pores simultaneously instead of patterning a single pore in a given location. Finer control of the deposition might be obtained using electrochemical methods.Our work is motivated by results and possible applications derived from protein nanopores. Biologically derived protein nanopores have been demonstrated for use in chemical detection and for DNA analysis. 6,7 Protein nanopores are studied while they are inserted in a lipid bilayer film. Because lipid membranes are fragile, the practical realization of these applications might require the use of an anthropogenic nanoscale pore. A stable, robust solid-state mimic might facilitate understanding of bionanopores and transport of large molecules through highly confined spaces by allowing control of the location, dimension, and composition of the pore. The challenge is to create one and only one hole, of nanometer scale in all dimensions, and in a defined location on a given substrate.A fabrication obstacle arises because many techniques which can reliably place patterns are expensive or create structures much larger than nanosize and those that create nanomaterials are often difficult to pattern down to a single feature. 8,9 One approach to resolving this discrepancy might b...

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Section: Discussionmentioning

confidence: 99%

Microelectroplating Silver on Sharp Edges toward the Fabrication of Solid-State Nanopores

Polk

Bernard

Kasianowicz

et al. 2004

J. Electrochem. Soc.

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“…While literature has shown some experimental investigations of vertical tip velocity and its effect on deposition [14], there is not much investigation on velocity parallel to the substrate.…”

Section: Fig 2 Modeling M Ethod and Input Parametersmentioning

confidence: 99%

“…Finally, while electrochemical processes have proven their capability in electro plating and electroforming over large areas, localizing the deposi tion remains a challenge. The few studies that have successfully localized depositions are limited to simple structures, such as metal lines and pillars [12][13][14][15][16][17]. Complex 3D structures have not yet been fabricated using this technique.…”

Section: Introductionmentioning

confidence: 99%

Finite Element Simulation of Localized Electrochemical Deposition for Maskless Electrochemical Additive Manufacturing

Brant

Sundaram

Kamaraj

2015

Journal of Manufacturing Science and Engineering

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Localized electrodeposition (LED) was explored as an additive manufacturing technique with high control over process parameters and output geometry. The effect of variation o f process parameters and changing boundary conditions during the deposition process on the output geometry was observed through simulation and experimentation. Trends were found between specific process parameters and output geometries in the simula tions; trends varied between linear and nonlinear, and certain process parameters such as voltage and interelectrode gap were found to have a greater influence on the output than others. The simulations were able to predict the output width of deposition of experiments in an error of 8-30%. The information gained from this research allows for greater understanding of LED output, so that it can potentially be applied as an additive manufacturing technique of complex three-dimensional (3D) parts on the microscale.

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“…ECD has a huge prospective to afford solutions to a variety of challenges for the microfabrication of threedimensional metal structures (20,21). Jansson et al had deposited a nickel structure from a different kind of nickel plating solutions (22). El-Giar and Thomson and El-Giar et al deposited long, thin micrometer-size copper columns, copper electrical interconnects, and tips for scanning probe microscopy applications (23,24).…”

Section: Micromanufacturing Using Ecdmentioning

confidence: 99%

Microelectrochemical Deposition

Habib¹

2014

Comprehensive Materials Processing

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High Resolution 3D Microstructures Made by Localized Electrodeposition of Nickel

Cited by 73 publications

References 9 publications

Microelectroplating Silver on Sharp Edges toward the Fabrication of Solid-State Nanopores

Microelectroplating Silver on Sharp Edges toward the Fabrication of Solid-State Nanopores

Finite Element Simulation of Localized Electrochemical Deposition for Maskless Electrochemical Additive Manufacturing

Microelectrochemical Deposition

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