High resolution and uniform image reconstruction in a large field-of-view for EUV actinic mask review

Kim, Hyun-Su; Locans, Uldis; Nebling, Ricarda; Dejkameh, Atoosa; Kazazis, Dimitrios; Ekinci, Yasin; Mochi, Iacopo

doi:10.1117/12.2573240

Cited by 4 publications

References 16 publications

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Photon flux dependent image resolution of reflective ptychographic microscope for extreme ultraviolet actinic mask metrology

Kim

Nebling

Dejkameh

et al. 2022

J. Micro/Nanopattern. Mats. Metro.

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Background: With the adoption of extreme ultraviolet (EUV) lithography in the semiconductor manufacturing, actinic EUV mask metrology has become a crucial technology to ensure the required defect sensitivity and throughput for high-volume manufacturing. Reflection-mode EUV scanning microscope (RESCAN) is a lensless actinic microscope dedicated to EUV mask metrology based on coherent diffraction imaging (CDI) as an alternative approach for EUV mask metrology and inspection.Aim and Approach: In CDI, the complex-amplitude image of the sample is obtained through its measured diffraction. Though this approach can overcome the disadvantages and limitations of conventional imaging systems, the quality of the recorded diffraction data is crucial for the reliable reconstruction of a high-resolution image. Ultimately, the signal-to-noise ratio of the recorded diffraction data depends on several parameters, such as the sample's reflectance, the quantum efficiency of the detector, its full well capacity, and the intensity of the illumination.Result: We investigate the optimal photon flux for RESCAN and provide a systematic study on the relation between the image resolution and the illumination intensity for CDI-based imaging at EUV wavelength. Conclusions:The insights provided will be helpful for the optimization of CDI for EUV imaging, in particular for increasing the throughput of EUV mask inspection with low power sources.

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Photon flux dependent image resolution of reflective ptychographic microscope for extreme ultraviolet actinic mask metrology

Kim

Nebling

Dejkameh

et al. 2022

J. Micro/Nanopattern. Mats. Metro.

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The unfolding road from dust to trust

Beiu

2022

Advances in 3OM: Opto-Mechatronics, Opto-Mechanics, and Optical Metrology

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Soft X-ray chemically sensitive ptychographic imaging of 3D nano-objects

Krasnov,

Makhotkin,

Scheerder

et al. 2024

Opt. Express

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The results of a soft X-ray chemically sensitive ptychographic imaging of non-planar nanoscale 3D objects - atom probe tomography tips, with resolution down to 12 nm at 800 eV using scanning X-ray microscope at the electron storage ring BESSY II are presented. We validate that this approach can be used to determine the tip (emitter) shape, and to resolve inner nano-scale structures as relevant for semiconductor applications and even for quantitative chemical composition analysis. Imaging of buried interfaces with below 30 nm resolution is demonstrated. This work might pave the way for contactless, ptychographic in-situ characterization of APT tips with tabletop coherent EUV sources.

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High resolution and uniform image reconstruction in a large field-of-view for EUV actinic mask review

Cited by 4 publications

References 16 publications

Photon flux dependent image resolution of reflective ptychographic microscope for extreme ultraviolet actinic mask metrology

Photon flux dependent image resolution of reflective ptychographic microscope for extreme ultraviolet actinic mask metrology

The unfolding road from dust to trust

Soft X-ray chemically sensitive ptychographic imaging of 3D nano-objects

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