High-Resolution Long-Array Thermal Ink Jet Printhead Fabricated by Anisotropic Wet Etching and Deep Si RIE

Nayve, R.; Fujii, Masahiro; Fukugawa, A.; Takeuchi, Toshio; Murata, M.; Yamada, Yoshiaki; Koyanagi, Mitsumasa

doi:10.1109/jmems.2004.835785

Cited by 26 publications

(11 citation statements)

References 9 publications

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“…Due to its excellent thermal and chemical stability, polyimide is compatible with most of the MEMS batch process. Photolithography using photosensitive polyimide [102,103,104], liftoff using sacrificial layer [101], and bonding using polyimide as an adhesion [105,106,107] are available techniques for polyimide.…”

Section: Organic Materialsmentioning

confidence: 99%

Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices

2019

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The development of reliable long-term encapsulation technologies for implantable biomedical devices is of paramount importance for the safe and stable operation of implants in the body over a period of several decades. Conventional technologies based on titanium or ceramic packaging, however, are not suitable for encapsulating microfabricated devices due to their limited scalability, incompatibility with microfabrication processes, and difficulties with miniaturization. A variety of emerging materials have been proposed for encapsulation of microfabricated implants, including thin-film inorganic coatings of Al2O3, HfO2, SiO2, SiC, and diamond, as well as organic polymers of polyimide, parylene, liquid crystal polymer, silicone elastomer, SU-8, and cyclic olefin copolymer. While none of these materials have yet been proven to be as hermetic as conventional metal packages nor widely used in regulatory approved devices for chronic implantation, a number of studies have demonstrated promising outcomes on their long-term encapsulation performance through a multitude of fabrication and testing methodologies. The present review article aims to provide a comprehensive, up-to-date overview of the long-term encapsulation performance of these emerging materials with a specific focus on publications that have quantitatively estimated the lifetime of encapsulation technologies in aqueous environments.

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Section: Organic Materialsmentioning

confidence: 99%

Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices

2019

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“…Using ICP vertical etching on the Si substrate by MEMS processes to form nozzles can create smaller nozzle sizes than other methods [ 23 , 24 ]. The assembled in nozzles and CMOS circuits of Timo Lindemann’s research, the printheads are made by a combination of a standard printhead CMOS substrate with a three-dimensional (3-D) structured polyimide nozzle plate, and that can avoid the results of three-layer assembly.…”

Section: Design Of the Multiplexer Inkjet Chip Systemmentioning

confidence: 99%

“…The ink inlet is a through-hole structure to supply ink from the ink tank to the ink chamber. The ink chamber is connected to each nozzle [ 24 ].…”

Section: Design Of the Multiplexer Inkjet Chip Systemmentioning

confidence: 99%

Investigation of CMOS Multiplexer Jet Matrix Addressing and Micro-Droplets within a Printhead Chip

Liou

Yang

2017

Micromachines

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In this study, we demonstrate and investigate a new droplet injection design. We create a thermal inkjet (TIJ) printhead using an application-specific integrated circuit system and bulk micromachining technology (microelectromechanical systems). We design inkjet printhead chips with a new structure and investigate their properties. For the new structure, the integration of complementary metal-oxide-semiconductors (MOSs) and enhancement-mode devices, as well as power switches and a TIJ heater transducer, enables logic functions to be executed on-chip. This capability is used in the proposed design to address individual jets with even fewer input lines than in matrix addressing. A high number of jets (at least 896) can be addressed with only 11 input lines. E1 (Enable 1) and E2 (Enable 2) are set up dependently, and they have the ability to reverse their signals in relation to each other (i.e., if E1 is disabled, E2 is enabled and vice versa). The E1 and E2 signals each service 448 jets. If one of the MOSs is turned on, then it corresponds to a power line with a similar function. If an addressing gate terminal of the other MOS has a discharge action, then we can control a different heater to generate heating bubbles in the jet inks. The operating frequency for addressing these measurements is 18 kHz in normal mode, 26 kHz in draft mode, and 16 kHz in best mode.

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“…It is because each jetting hole in the ink jetting device has an independent jetting chamber, an actuator and a micron-sized jetting hole. Spray chamber can be filled with a certain amount of liquid [13][14][15][16][17][18]. When the actuator squeezes the liquid in the chamber and then passes through the micron-sized orifice, the fixed-size and uniform-size micrometer-sized liquid droplets can be jetted, as shown in Figures 1 and 2.…”

Section: Introductionmentioning

confidence: 99%

Precisely Addressed (DNA Gene) Spray Microfluidic Chip Technology

Liou¹

2018

Microfluidics and Nanofluidics

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This study is the subject of precisely addressed (DNA Gene) spray microfluidic chip. It is a special chip (ASIC) designed to spray liquid medical wisdom DNA gene sequencing system technology transfer fabric onto the glass slide. Thermal bubble liquid bead generation, it produces a very large thrust bubble in a short time to launch the liquid. It forms micro-droplets. It is in the biomedical micro-beads quantitative, it uses the address spray liquid crystal structure of the cavity. It uses the principle of ink-jet printer cloth DNA liquid onto glass slides. It does DNA sorting for each style. Bubble inkjet technology is in the inkjet head position on the wall with heating electrodes. It is by pulsing the selected heating element by electrical pulses. It produces ink droplets on the inkjet head. It is heated to a certain temperature after the electrode. It makes the droplet a tiny bubble and explodes. It is then discharged through the heating chamber through the inkjet head. It is attached to the substrate surface. It is printed on the amount of ink droplets depends on the temperature control of the heating device.

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High-Resolution Long-Array Thermal Ink Jet Printhead Fabricated by Anisotropic Wet Etching and Deep Si RIE

Cited by 26 publications

References 9 publications

Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices

Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices

Investigation of CMOS Multiplexer Jet Matrix Addressing and Micro-Droplets within a Printhead Chip

Precisely Addressed (DNA Gene) Spray Microfluidic Chip Technology

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