High-Specific-Power Capacitors

Ennis, J.B.; MacDougall, F.W.; Yang, Xiaolong; Bushnell, A.; Cooper, Robert; Gilbert, John E.

doi:10.1109/ipmc.2008.4743574

Cited by 6 publications

(4 citation statements)

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“…For the larger capacitor active volume, the extrinsic breakdown always dominates due to scaling characteristics of Weibull distribution . The use of asymmetric electrodes for high specific power polymer capacitors was shown to have promise with the thinner electrode permitting graceful failure whereas the thicker electrode contributed to heat dissipation . The polarity (+/‐) of the top pin on the thin electrode (2 nm) was varied with respect to the grounded thick electrode (20 nm) side of the glass substrate.…”

Section: Discussionmentioning

confidence: 99%

Electrode‐Limited Dielectric Breakdown of Alkali Free Glass

et al. 2012

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The dielectric breakdown statistics of alkali‐free glass was determined for various thicknesses with electrodes having controlled morphology and continuity. The characteristic electrical breakdown field strength increased from 400 to 1100 MV/m as the glass substrate thickness decreased from 58 to 5 μm, respectively. Surface roughness RMS values of as‐drawn and etched glass substrates were in the 0.9–1.8 nm range, which is small in comparison to the glass substrate thickness. The glass etching, itself did not have significant effect on the dielectric breakdown strength. The dielectric breakdown strength was also independent of the sputtered‐deposited electrode composition (Au, Pt); however, electrode thickness played an important role in controlling the breakdown process. The Au electrode morphology transitioned from a continuous sheet for thicker electrodes to discrete nano‐scale islands for very thin electrodes (<2 nm thick). The thin electrode morphology provides a unique opportunity to explore the intrinsic properties and high dielectric breakdown strength regime (1100 MV/m) in glasses with Weibull modulus values approaching 100.

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Section: Discussionmentioning

confidence: 99%

Electrode‐Limited Dielectric Breakdown of Alkali Free Glass

et al. 2012

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“…For capacitors to operate reliably at elevated temperature, efficient heat removal from interior of capacitors is essential but often challenging, especially in metallized film designs because of the low thermal conductivity of both the polymer dielectric and the thin metallization . As electrical insulators, polymer dielectrics are poor thermal conductors with thermal conductivity ranging from 0.1 W/(m·K) for amorphous polymers to about 0.6 W/(m·K) for biaxial-oriented polypropylene (BOPP) capacitor films .…”

Section: Relevant Polymer Characteristics For Capacitor Dielectricsmentioning

confidence: 99%

Polymer Capacitor Dielectrics for High Temperature Applications

Greenbaum

2018

ACS Appl. Mater. Interfaces

286

164

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Much effort has been invested for nearly five decades to identify and develop new polymer capacitor dielectrics for higher than ambient temperature applications. Simultaneous demands of processability, dielectric permittivity, thermal conductivity, and dielectric breakdown strength dictated by increasing high power performance criteria limit the number of available materials. The present review first explains the advantages of metallized polymer film capacitors over the film-foil, ceramic, and electrolytic counterparts and then presents a comprehensive review on both past developmental effort of commercial resins and recent research progress on new polymers targeted for operating temperature above 150 °C. Some historical background and discussion on the limitation of the commercially available polymer film dielectrics for high temperature applications are also given. In many cases, further development of promising polymers that appear to possess all or most of the important criteria is limited by lack of large scale market incentives but could be of great value to niche applications in the military or aerospace realm.

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“…For reliable operation at elevated temperatures, efficient heat removal from the interior of capacitors is essential but often challenging, especially in metallized polymer film designs due to the low thermal conductivity of both the polymer dielectric and the thin metallization [33]. As electrical insulators, polymer dielectrics are poor thermal conductors with thermal conductivities ranging from 0.1 W/(m•K) for amorphous polymers [34] to about 0.6 W/(m•K) for the present state-of-the-art BOPP capacitor films [35].…”

Section: Thermal Conductivitymentioning

confidence: 99%

Polyimides as High Temperature Capacitor Dielectrics

Ho¹,

Schroeder²

2021

Polyimide for Electronic and Electrical Engineering Applications

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Nearly five decades of effort has focused on identifying and developing new polymer capacitor films for higher-than-ambient temperature applications, but simultaneous demands of processability, dielectric permittivity, thermal conductivity, dielectric breakdown strength, and self-clearing capability limit the number of available materials. Demands on these criteria are even more stringent in growing numbers of applications demanding high power performance. Aromatic polyimides, though not a panacea, are a class of heat-resistant polymers of great interest to researchers as capacitor dielectrics because of good thermal and mechanical stability. In this chapter, the key aspects and advantages of metallized polymer film capacitors are compared to analogous alternative technologies (polymer-film-metal-foil, ceramic, and electrolytic capacitors), followed by a comprehensive review of commercial resin development leading up to recent research on polyimides targeted for operating temperature above 150°C. Finally, this chapter provides a brief discussion on the recent effort on combining computation and synthesis to design polymers with desirable dielectric properties.

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High-Specific-Power Capacitors

Cited by 6 publications

References 0 publications

Electrode‐Limited Dielectric Breakdown of Alkali Free Glass

Electrode‐Limited Dielectric Breakdown of Alkali Free Glass

Polymer Capacitor Dielectrics for High Temperature Applications

Polyimides as High Temperature Capacitor Dielectrics

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