High-speed dicing of silicon wafers conducted using ultrathin blades

Zhou, Hongxiu; Qiu, Shuo; Huo, Yanxia; Zhang, Nianmin

doi:10.1007/s00170-012-4379-6

Cited by 19 publications

(7 citation statements)

References 15 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Similar (Fig. 2d) and other forms of wear appearing on the cutting tools in wide areas of applications were shown and discussed also in the work of Nordström and Bergström [10], Darmawan et al [11], Zhou et al [12], Ghosh at al., [13], Chayeuski et al [14], Jang et al [15] as well as in websites [16][17][18].…”

Section: Surface Characteristics Of Industrial Cutting Blades In the supporting

confidence: 77%

Regeneration of industrial cutting blades made from X39Cr13 steel used in skinning process of Pleuronectidae-family flatfishes

Zieliński¹,

Kapłonek

Nadolny

2018

Journal of Mechanical and Energy Engineering

View full text Add to dashboard Cite

Section: Surface Characteristics Of Industrial Cutting Blades In the supporting

confidence: 77%

Regeneration of industrial cutting blades made from X39Cr13 steel used in skinning process of Pleuronectidae-family flatfishes

Zieliński¹,

Kapłonek

Nadolny

2018

Journal of Mechanical and Energy Engineering

View full text Add to dashboard Cite

“…Both sides of these blades contain diamonds grits that minimize surface chipping, slanted cuts, and improve cutting quality. Compared to others blades, NBC-ZB show fine grit size, required for highquality processing, such as deep and narrow grooves [15]. Although longer blade exposure is associated to larger chipping [18], chipping free cuts can be seen at all three fabrication stages (Fig.…”

Section: Resultsmentioning

confidence: 96%

“…Blade dicing has been the most widely used process in the separation of silicon wafers into individual chips/devices both in semiconductor and micro-electro-mechanical systems (MEMS) technologies [13][14][15]. Since blade dicing is a purely mechanical process, its employment can produce undesirable mechanical vibrations, stress, and localized defects in the wafer [16].…”

Section: Introductionmentioning

confidence: 99%

Out-of-plane neural microelectrode arrays fabrication using conventional blade dicing

Goncalves

Oliveira

Peixoto

et al. 2015

Int J Adv Manuf Technol

View full text Add to dashboard Cite

This paper describes an optimized out-of-plane fabrication method for neural 3D high-aspect-ratio microelectrode array (MEA) based on a dicing technology platform (a standard procedure in semiconductor industry). The proposed MEA fabrication required important modifications in the dicing process. Since electrodes length reaches up to 4 mm, the main hindrance was the 2 mm cutting depth limit allowed for dicing machines with regular blades. This new procedure consisted on modifying Z-axis calibration, so cuts as deep as the exposure of blades were possible. The employment of proper blades for each fabrication step was also mandatory. Thin and high-exposure blades were used for deep cuts in silicon wafers, and V-shaped blades were employed to produce sharpened tips on the electrodes. Moreover, parameters as very low-cut speeds were essential to avoid wafer chipping and microcracks. Results showed high-precision and high-quality cuts in all steps of the 3D

show abstract

“…Much more common is using of disk saws, or, in the case of large objects, core drills (Stein & Sander, 2009), usually with powdered diamonds. Thicknesses of the disks start from 0.02 mm (Franssila, 2010;Zhou et al, 2012) with sporadic reports of values 0.010-0.015 mm (Arnold, 1958;UKAM Industrial Superhard Tools, www.ukam.com), but such disks are very fragile and suitable only for thin objects (being used mainly for cutting of semiconductors in the electronics industry). In paleontology and neontology, disk or band saws (or coring bits) tenths of a millimeter thick are used (e.g., Donath & Rohrer, 2003;Stein & Sander, 2009;Lamm, 2013;Wang et al, 2013;Haas & Storå, 2015).…”

Section: Sectioning Of the Samplementioning

confidence: 99%

Preparation of ground sections using UV-curable acrylic adhesives

Dobrovolsky

2023

Biosys. divers.

View full text Add to dashboard Cite

Study of ground sections is the most used and, in some respects, still irreplaceable method for examination the microstructure of paleontological and many other hard and friable objects. At the same time, paleontological samples are relatively difficult for preparations of high-quality thin sections. Many techniques and means, particularly embedding media, have been proposed, but they are often hardly accessible, imperfect or insufficiently studied. A promising and easily accessible non-specialized medium, UV-curable acrylic adhesive (glue for glass) was tested for embedding and mounting of objects with diverse mechanical and optical properties. It shows notably good results, in particular durability, reliable adhesion, ease of use and lack of significant birefringence, which makes it especially valuable for polarized light microscopy. Properties of such adhesives are reviewed and compared with properties of epoxy resins and a number of other media. Disadvantages of the adhesives and ways to deal with them are also elucidated. In addition, broadly accessible tools and methods of sawing, embedding, grinding, mounting and other stages of the work are discussed. Efficiency of a number of grinding agents is measured. On the basis of all these results, a technique of making ground sections using easily accessible means was developed and described step by step. The technique was designed for fossil bones, but is applicable to diverse dry samples, including paleontological, neontological and geological ones.

show abstract

High-speed dicing of silicon wafers conducted using ultrathin blades

Cited by 19 publications

References 15 publications

Regeneration of industrial cutting blades made from X39Cr13 steel used in skinning process of Pleuronectidae-family flatfishes

Regeneration of industrial cutting blades made from X39Cr13 steel used in skinning process of Pleuronectidae-family flatfishes

Out-of-plane neural microelectrode arrays fabrication using conventional blade dicing

Preparation of ground sections using UV-curable acrylic adhesives

Contact Info

Product

Resources

About