High-Speed Differential Via Optimization using a High-Accuracy and High-Bandwidth Via Model

Li, Chaofeng; Cai, Kevin; Mathew, Manish Kizhakkeveettil; Mousavi, Seyedmehdi; Ouyang, Muqi; Sen, Bidyut; Kim, DongHyun Bill

doi:10.1109/emcsipi50001.2023.10241408

Cited by 7 publications

(1 citation statement)

References 16 publications

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“…The design of signal via structures is more complex compared to traces. In multilayer boards, when current passes through the via, a parallel plate mode occurs between the reference planes [2][3][4], leading to the excitation of electromagnetic waves and resonance phenomena [5]. By adding ground vias around the signal via, resonance can be effectively suppressed [6].…”

Section: Introductionmentioning

confidence: 99%

Design of high-frequency test fixture considering impedance matching

Peng,

Cai,

Yang

et al. 2024

International Conference on Mechatronic Engineering and Artificial Intelligence (MEAI 2023)

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This paper presents the design of a high-frequency test fixture for high-speed connectors. Specifically, after analyzing and designing the board material, laminate structure, trace structure, and signal via structure, the impedance consistency and bandwidth of the high-speed interconnect structure are verified through TDR and S-parameter simulations conducted in HFSS. a PCB layout is generated using Cadence. The test results confirm that the differential impedance of the fixture meets the requirements for high-speed connector testing. Within the frequency range of 0-30 GHz, the difference between S11 and S21 for the 2x-thru structure is greater than 0 dB, indicating a bandwidth capability of up to 30 GHz for the fixture.

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