2007 IEEE International Electron Devices Meeting 2007
DOI: 10.1109/iedm.2007.4419033
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High-Speed InP HBT Technology for Advanced Mixed-signal and Digital Applications

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Cited by 18 publications
(10 citation statements)
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“…SiGe-based heterojunction bipolar transistor (HBT) mixers [1,2], SiGe-based BiCMOS mixers [3,4,5,6,7], CMOS-based mixers [8,9,10,11] and mixers based on InP HBT technology [12,13,14,15] were presented. Particularly, InP double heterojunction bipolar transistor (DHBT) has the advantages of outstanding high frequency performance, high electron mobility and high breakdown voltage [16,17], which indicates that InP DHBT is an attractive choice for wideband mixers. Several enhancement techniques have been employed to extend the bandwidth of mixers.…”
Section: Introductionmentioning
confidence: 99%
“…SiGe-based heterojunction bipolar transistor (HBT) mixers [1,2], SiGe-based BiCMOS mixers [3,4,5,6,7], CMOS-based mixers [8,9,10,11] and mixers based on InP HBT technology [12,13,14,15] were presented. Particularly, InP double heterojunction bipolar transistor (DHBT) has the advantages of outstanding high frequency performance, high electron mobility and high breakdown voltage [16,17], which indicates that InP DHBT is an attractive choice for wideband mixers. Several enhancement techniques have been employed to extend the bandwidth of mixers.…”
Section: Introductionmentioning
confidence: 99%
“…The high-speed digital devices in this technology have peak performance in the region of 3 to 4 mA/um 2 emitter current density and demonstrate β > 50, f T ≈ 250 GHz and f MAX ≈ 350 GHz. The mixed-signal transistors have peak performance in the region of 1 to 1.5 mA/um 2 emitter current density and demonstrate β > 50, f T ≈ 150 GHz and f MAX ≈ 400 GHz [6]. The HBT structure has an InP emitter with an In-rich, n+ InGaAs cap for low emitter contact resistance.…”
Section: A Technology Description and Device Performancementioning
confidence: 98%
“…The device contact via process, developed with a highly selective dielectric etch, enables device scaling down to 0.25-m emitter widths at no manufacturing penalty. The remaining active and passive element process steps can be found in [8]. The technology offers Schottky diodes, 0.19 fF/Pm 2 MIM capacitors, and dual precision thin film resistors of 20 and 100 :/.…”
Section: Materials Growth and Device Fabricationmentioning
confidence: 99%