High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package

Inamdar, Adwait; Yang, Yu-Hsiang; Prisacaru, Alexandru; Gromala, Przemyslaw Jakub; Han, Bongtae

doi:10.1016/j.polymdegradstab.2021.109572

Cited by 39 publications

(20 citation statements)

References 14 publications

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“…It might have been caused by the fiber-matrix interface weakening on the composites. Nevertheless, for both fique fabric composites and plain epoxy, an increase of Tg was observed for the samples aged up to 120 h. The results revealed an increase of up to 45 • C on Tg, the same as found by Inamdar et al [41].…”

Section: Loss Modulussupporting

confidence: 87%

“…In addition, microcracks could be observed in some aged samples. The aging of polymers in an oxidative environment, such as the one employed in this study, leads to a heterogeneous degradation, which is governed by the diffusion of oxygen through the polymer [41]. Previous studies [41,48,49] have indicated that thermal aging has a strong influence on the properties of polymer-based materials.…”

Section: Effects Of Thermal Aging On Plain Epoxymentioning

confidence: 99%

“…The aging of polymers in an oxidative environment, such as the one employed in this study, leads to a heterogeneous degradation, which is governed by the diffusion of oxygen through the polymer [41]. Previous studies [41,48,49] have indicated that thermal aging has a strong influence on the properties of polymer-based materials. The whitecolored spots in the SEM image of Figure 5d are related to an oxide layer observed in all thermally aged epoxies [50].…”

Section: Effects Of Thermal Aging On Plain Epoxymentioning

confidence: 99%

“…The fique fabric-epoxy composite and plain epoxy samples were subjected to an accelerated aging test performed in air chambers (Nova Instruments, Wakefield, MA, USA) at 170 • C for progressively increasing time lengths (0, 3, 5, and 10 days). The aging temperature of 170 • C was selected as the limit temperature before degradation in both the epoxy [41,42] and the fique fabric, as further discussed in the corresponding thermogravimetric curves. Precaution was taken that the samples would not touch each other or the inner walls.…”

Section: Accelerated Agingmentioning

confidence: 99%

“…In both situations, what could have occurred what the literature reports as a diffusion-limited oxidation (DLO) phenomenon. The DLO facilitates the formation of a heterogeneous oxidized layer such that the regions near the air-exposed surfaces are heavily oxidized compared to the interior regions, which show reduced or minimal oxidation [41]. In summary, the DLO of polymers is the combination of two processes: (1) diffusion of oxygen and (2) reaction of oxygen.…”

Section: Tan Deltamentioning

confidence: 99%

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Dynamic Mechanical Analysis of Thermally Aged Fique Fabric-Reinforced Epoxy Composites

et al. 2021

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Dynamic mechanical analysis (DMA) is one of the most common methods employed to study a material’s viscoelastic properties. The effect of thermal aging on plain epoxy and a fique fabric-reinforced epoxy composite was investigated by comparing the mass loss, morphologies, and DMA properties of aged and unaged samples. In fact, thermal aging presents a big challenge for the high-temperature applications of natural fiber composites. In this work, both plain epoxy and fique fabric-reinforced epoxy composite were found to have different molecular mobility. This leads to distinct transition regions, with different changes in intensity caused by external loadings from time-aging. Three exponentially modified Gauss distribution functions (EMGs) were applied to loss factor curves of fique fabric-reinforced epoxy composite and plain epoxy, which allowed identifying three possible mobility ranges. From these results it was proposed that the thermal degradation behavior of natural fibers, especially fique fiber and their composites, might be assessed, based on their structural characteristics and mechanical properties.

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Section: Loss Modulussupporting

confidence: 87%

Section: Effects Of Thermal Aging On Plain Epoxymentioning

confidence: 99%

Section: Effects Of Thermal Aging On Plain Epoxymentioning

confidence: 99%

Section: Accelerated Agingmentioning

confidence: 99%

Section: Tan Deltamentioning

confidence: 99%

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Dynamic Mechanical Analysis of Thermally Aged Fique Fabric-Reinforced Epoxy Composites

et al. 2021

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High‐Temperature Polymer‐Based Dielectrics for Advanced Electronic Packaging

Liu,

Li,

Zhao

et al. 2023

High Temperature Polymer Dielectrics

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Development of Molding Compounds Based on Epoxy Resin/Aromatic Amine/Benzoxazine for High‐Temperature Electronic Packaging Applications

Gou

Bao

Huang

et al. 2022

Macro Materials & Eng

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Heat-resistant molding of compounds is an indispensable part in encapsulating future electronic power devices. Herein, it is used for polyfunctional epoxy resin (EP) and diamine-phenol benzoxazine (BOZ) as resin matrix, 4,4'-diaminodiphenylmethane (DDM) as curing agent, and iron acetylacetonate (Fe(acac) 3 ) as curing accelerator, as well as inorganic fillers and other auxiliaries, to prepare heat-resistant molding compounds. The curing behavior, processability and thermal performance of the EP/DDM/BOZ (EDB) resin blends containing different contents of DDM, BOZ, and Fe(acac) 3 are first systematically investigated. The EDB molding compounds (MC EDB ) with suitable BOZ content show good processability, and the molding process can be compatible with that of commercial epoxy molding compounds (EMC). With increasing the BOZ content, the glass transition temperature of cured MC EDB is greatly enhanced to a maximum of 261 °C determined by dynamic mechanical analyzer, owing to the hydrogen-bond interaction generated after polymerization of BOZ increasing the rigidity of network chains. Moreover, the cured MC EDB also exhibits higher thermal decomposition stability, better high-temperature (200 °C) mechanical properties, and lower water absorption compared to the cured EMC. After high-temperature (200 °C) aging for 500 h, the cured MC EDB with suitable BOZ content still maintains outstanding performance. This study provides a promising strategy for preparing heat-resistant electronic packaging molding compounds.

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High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package

Cited by 39 publications

References 14 publications

Dynamic Mechanical Analysis of Thermally Aged Fique Fabric-Reinforced Epoxy Composites

Dynamic Mechanical Analysis of Thermally Aged Fique Fabric-Reinforced Epoxy Composites

High‐Temperature Polymer‐Based Dielectrics for Advanced Electronic Packaging

Development of Molding Compounds Based on Epoxy Resin/Aromatic Amine/Benzoxazine for High‐Temperature Electronic Packaging Applications

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