High-temperature creep and hardness of eutectic 80Au/20Sn solder

Liu, Y.C.; Teo, Joseph Chee Ming; Tung, S. K.; Lam, Kai‐Yang

doi:10.1016/j.jallcom.2006.12.142

Cited by 125 publications

(48 citation statements)

References 15 publications

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“…Reliable thermodynamic information on the relative stabilities of TM-germanides is essential to control the interfacial microstructure evolution and thus to design optimal processing. On the other hand, Au-based alloys containing Ge are of interest for novel high temperature lead-free solder alloys [6][7][8][9]. For example, the Au-Ge binary system is characterised by a deep eutectic reaction with its temperature of around 360 • C, making it interesting for high temperature Au-based solders.…”

Section: Introductionmentioning

confidence: 99%

Thermodynamic assessment of the Cu–Ge binary system

Wang

Jin

Leinenbach

et al. 2010

Journal of Alloys and Compounds

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Section: Introductionmentioning

confidence: 99%

Thermodynamic assessment of the Cu–Ge binary system

Wang

Jin

Leinenbach

et al. 2010

Journal of Alloys and Compounds

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“…The Ag 2 O pastes were produced by mixing 1 g of Ag 2 O microparticles with 180 ml of the various PEGs. As shown in Fig.…”

Section: Methodsmentioning

confidence: 99%

Effect of Polyethylene Glycols with Different Polymer Chain Lengths on the Bonding Process Involving <i>In Situ</i> Formation of Silver Nanoparticles from Ag<sub>2</sub>O

2013

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The need for lead-free alternatives to conventional solders for metal-bonding processes has prompted the development of processes based on metal nanoparticles. In this study, the low-temperature bondability of silver oxide (Ag 2 O) pastes containing polyethylene glycols (PEGs) with different polymer chain lengths was investigated. Bonding was achieved because of the low-temperature sinterability of silver nanoparticles that form in situ through redox reactions between Ag 2 O and PEGs. It was found that PEGs with shorter chain length provide superior bondability at low bonding temperatures. Thermogravimetric-differential thermal analysis and thermomechanical analysis showed that shorter PEGs resulted in less residual organic material in the sintered silver layer and contributed to form a larger amount of silver nanoparticles. Therefore, pastes with shorter PEGs afforded well-sintered, high-density silver joints and exhibited superior bondability even at lower temperatures. Using ethylene glycol, which has the shortest chain length, the tensile strength achieved was 11 MPa for bonding at 150°C.

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“…Some reported data [9,10,17,18] are also collected in the table for comparison. As expected CC alloy exhibits the lowest hardness (HV138) and ICC alloy has the highest hardness (HV219) in the three tested samples.…”

Section: Microhardness At Room Temperaturementioning

confidence: 99%

“…Many studies of the AuSn20 solder are focusing on the soldering process, the microstructure evolution in the soldering joints [6,7], and the solder alloy's performance [8][9][10]. Considering the manufacturing of this alloy, some unsolved problems still remain, such as the microstructure evolution in the processing and the mechanical behavior of the bulk AuSn20 solder alloy.…”

Section: Introductionmentioning

confidence: 99%

Evolution of primary phases and high-temperature compressive behaviors of as-cast AuSn20 alloys prepared by different solidification pathways

et al. 2011

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The as-cast AuSn20 eutectic alloys prepared by four different solidification pathways have been investigated in terms of the microstructure and the high-temperature compressive behaviors. The primary phases appeared in the four alloys are very sensitive to the cooling rate, which decrease in the size and the volume fraction as the cooling rate increases. The morphologies of the primary ζ′-Au 5 Sn phase are in dendritic at low cooling rate and change to rosette-like at high cooling rate. When the cooling rate is about 3.5× 10 4 K/min, the primary ζ′-Au 5 Sn can be suppressed but small δ-AuSn particles appear instead as the primary phase. The compressive behaviors at 220°C exhibit a low yielding stress and a long stress platform for the alloy prepared by injection casting with a copper crucible, which indicates an advantageous processing route for the production of the AuSn20 strips or foils.

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High-temperature creep and hardness of eutectic 80Au/20Sn solder

Cited by 125 publications

References 15 publications

Thermodynamic assessment of the Cu–Ge binary system

Thermodynamic assessment of the Cu–Ge binary system

Effect of Polyethylene Glycols with Different Polymer Chain Lengths on the Bonding Process Involving <i>In Situ</i> Formation of Silver Nanoparticles from Ag<sub>2</sub>O

Evolution of primary phases and high-temperature compressive behaviors of as-cast AuSn20 alloys prepared by different solidification pathways

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