High temperature degradation of palladium coated copper bond wires

Krinke, J.; Dragicevic, D.; Leinert, S.; Friess, E.; Glueck, J.

doi:10.1016/j.microrel.2014.07.097

Cited by 15 publications

(3 citation statements)

References 5 publications

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“…Similar to dielectric breakdown testing, reliability modeling is commonly used to analyze corrosion failure. However, rather than a Weibull model, corrosion is most commonly modeled using a log normal distribution. − The cumulative density function (CDF) of the lognormal distribution takes the form F ( τ ) = 1 2 [ 1 + erf true( ln nobreak0em.25em⁡ τ − γ η 2 true) ] where γ and η are the shape and scale parameters, respectively. Here, the dependent variable τ is the failure times from the accelerated corrosion tests.…”

Section: Results and Discussionmentioning

confidence: 99%

Polyimide Films Manufactured Using Partially Wet Electrospray Deposition

Kingsley

Chiarot

2023

ACS Appl. Polym. Mater.

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In electrospray deposition (ESD), solute material is dispersed in a carrier solvent and atomized into a cloud of microdroplets under the influence of a strong electric potential. The volatility, ESD parameters, and environmental conditions determine the rate of solvent evaporation. Complete in-flight solvent evaporation produces dry particles of material that are deposited on the target. In contrast, when the evaporation is incomplete, some residual solvent is delivered with the material. We define these regimes as dry (complete evaporation) and partially wet (incomplete evaporation) ESD. Here, we compare the microstructure and functional characteristics of films deposited in both regimes. We selected polyimide as our solute material given its importance in electronic, health, and environmental applications. An electrospray printhead that provides a tunable solvent evaporation rate via co-flowing air is used to deploy the polyimide. The dry and partially wet regimes can be selected by altering the solution flow rate and the air co-flow rate. Particulate films are formed when the polyimide is delivered to the target dry (solventfree). When solvent is delivered with the polyimide, a dense (partially wet) film is formed on the target. A numerical model of droplet evaporation was developed, which shows the dominant effects of solution flow rate and freestream vapor concentration on the ESD regime. The dry and partially wet films were compared for various functional characteristics including dielectric strength, optical characteristics, and corrosion resistance. For most metrics, the partially wet ESD films outperformed the dry ESD films. Compared to the dry ESD films, the partially wet films had far greater dielectric strength (up to 340 V/μm) and higher optical transparency. Both ESD regimes provided comparable corrosion resistance, which enhanced the reliability of metallic bond joints in an electronics package.

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Section: Results and Discussionmentioning

confidence: 99%

Polyimide Films Manufactured Using Partially Wet Electrospray Deposition

Kingsley

Chiarot

2023

ACS Appl. Polym. Mater.

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“…The added Pd and Pt are enriched near the grain boundary and the crack part, thereby preventing the corrosion from progressing to the grain, but at the same time accelerating the corrosion along the grain boundary. Krinke et al [ 100 ] conducted a high-temperature storage life (HTSL) test using a 30 μm PdCu wire and found that the stitch pull strength decreased faster as the storage time increased ( Figure 32 ). The reason is that the Pd layer is broken at the time of the stitch bond, which opens the diffusion path of Cu to the surface of Pd, and then forms a gap, and a hillock is formed above the gap (CuO, shown by the white arrow in Figure 33 ).…”

Section: The Effect Of Pd On Intermetallic Compounds (Imcs) and Relia...mentioning

confidence: 99%

“… Cross sectional SEM micrograph of the molded PdCu wire stitch bonded on a pre-plated lead frame after 2200 h@175 °C HTSL. The arrow marks the location of the hillock on top of a void in the Cu core [ 100 ]. Copyright, 2014, Elsevier.…”

Section: Figurementioning

confidence: 99%

Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging

Zhang,

Guo,

Cao

et al. 2023

Micromachines

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Wire-bonding technology is the most commonly used chip interconnection technology in microelectronic packaging. Metal bonding wire is the key material for wire bonding and plays an important role in the reliability of electronic devices. In recent years, palladium-plated copper (PdCu) bonding wire has been widely used because of its low cost, good electrical and thermal conductivity, the fact that it is not easy to oxidize, and its high reliability. Therefore, it is necessary to review its research progress. In this paper, the preparation and application of palladium-plated copper bonding wire are reviewed. Firstly, the preparation methods of electroplating, electroless plating, and direct plating are introduced. Secondly, the factors affecting the distribution of Pd in free air balls and bonding interfaces, the effect of Pd on the formation and growth of intermetallic compounds in PdCu wire, stitch bond, and reliability of PdCu wire are summarized and analyzed in the application process. Finally, its development prospect is prospected. Hopefully, this review can help readers to have a comprehensive understanding of the preparation and application of palladium-plated copper bonding wires, and can accelerate the promotion of its application in more fields in the future.

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