High-temperature polymer dielectrics with superior capacitive energy storage performance

Qin, Hongmei; Song, Jinhui; Liu, Man; Zhang, Yibo; Qin, Shiyu; Chen, Hang; Shen, Kangdi; Wang, Shan; Li, Qi; Yang, Quanling; Akbar, Abdul Rehman

doi:10.1016/j.cej.2023.142068

Cited by 24 publications

(5 citation statements)

References 42 publications

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“…And a higher 𝛽 value corresponds to greater reliability and stability for the film under high voltage. [20] The It should be noted that the variation trend of 𝛽 for each API content at different temperatures is the same. [21] Specifically, the 𝛽 values of FPI/API alloys at 200 °C are 32.9, 29.9, 25.7, and 19.4 for API contents of 25%, 50%, 75%, and 100%, respectively.…”

Section: Resultsmentioning

confidence: 95%

Significant Enhancement in Dielectric Properties of Polyimide Alloys Through a Two‐Phase Interlocking Structure

Liu,

Song,

Qin

et al. 2024

Adv Funct Materials

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High temperature dielectric polymers are the favored materials for energy storage devices under harsh‐environment, e.g., electronic devices and power systems. It is widely acknowledged that the energy storage capabilities of dielectric polymers are markedly deteriorated at elevated temperature because of the exponential increased leakage current. Herein, all‐organic dielectric polymer alloys with two‐phase continuous hard‐soft structure have been firstly investigated via blending high glass transition temperature (Tg) fluorinated polyimide (FPI) and high bandgap aliphatic polyimide (API). The large energy band difference between FPI and API is conducive to trap energy and greatly inhibits conduction loss. In addition, the hard and soft molecular chains with two‐phase interlocking structures are more closely arranged, bringing torturous pathways for charge carriers and reducing free volume, which enhances the breakdown strength. FPI/API alloy with high Tg (296 °C) and concurrent large bandgap delivers an ultrahigh discharge energy density of 6.6 J cm−3 at 150 °C and 3.02 J cm−3 at 200 °C with 90% discharge efficiency, significantly surpassing those reported dielectrics. Moreover, the FPI/API alloy exhibits remarkable cyclability and dielectric stability up to 10000 charge‐discharge cycles even at elevated temperatures. This work provides an unprecedented opportunity on structure design of dielectric polymers to achieve high‐temperature energy storage capacitors.

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Section: Resultsmentioning

confidence: 95%

Significant Enhancement in Dielectric Properties of Polyimide Alloys Through a Two‐Phase Interlocking Structure

Liu,

Song,

Qin

et al. 2024

Adv Funct Materials

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“…As observed, PEN-DCPD/PCBM 0.4 significantly outperformed the existing high-temperature dielectric polymers. [2,4,6,8,11,14,28,[32][33][34][35][36][37][38][39] Moreover, when the temperature increased to 200 °C, the 𝜂 of PEN-DCPD at 150 MV m −1 fell below 50%. Contrastingly, for PEN-DCPD/PCBM 0.4 and PEN-DCPD/F-TCNQ 0.2 , an 𝜂 of 90% corresponded with electric field strengths of 217 and 272 MV m −1 and U d values of 0.65 and 1.16 J cm −3 , respectively.…”

Section: Resultsmentioning

confidence: 97%

Aromatic‐Free Polymers Based All‐Organic Dielectrics with Breakdown Self‐Healing for High‐Temperature Capacitive Energy Storage

Chen,

Pei,

Liu

et al. 2023

Advanced Materials

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High‐temperature dielectric polymers are becoming increasingly desirable for capacitive energy storage in renewable energy utilization, electrified transportation, and pulse power systems. Current dielectric polymers typically require robust aromatic molecular frameworks to ensure structural thermal stability at elevated temperatures. Nevertheless, the introduction of aromatic units compromises electrical insulation owing to pronounced π–π interactions that facilitate electron transport and eliminates the breakdown self‐healing property owing to their high carbon content. Herein, we describe an aromatic‐free polynorborne copolymer exhibiting an electrical conductivity—two orders of magnitude lower than that of state‐of‐the‐art polyetherimide—at elevated temperatures and high electric fields owing to its large bandgap (∼ 4.64 eV) and short hopping conduction distance (∼ 0.63 nm). Density functional theory calculations demonstrate that the copolymer can effectively suppress the excitation of high‐field valence electrons. Furthermore, the incorporation of trace semiconductors results in high discharge density (3.73 J cm−3) and charge–discharge efficiency (95% at 150°C), outperforming existing high‐temperature dielectric polymers. The excellent electrical breakdown self‐healing capability of the copolymer film at elevated temperatures further demonstrates its potential for use in dielectric capacitors capable of continuous operation under extreme conditions.This article is protected by copyright. All rights reserved

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“…The increased focus on these polymers can be ascribed to their outstanding characteristics, including flexibility, ease of processing, distinctive self-repair capabilities, and superior breakdown field strength ( E b ). 8–11 Consequently, a spectrum of high-performance polymers, such as polyimide (Kaptons PI), polycarbonate (PC), polyetherimide (PEI), poly (ether ketone) (PEEK), and fluorene polyester (FPE), have been thoroughly investigated as potential substitutes for BOPP in applications associated with high-temperature capacitive energy storage. 12–14 However, the energy storage density in most contemporary polymers remains suboptimal, primarily attributed to their relatively low dielectric constant ( ε r ) and constrained electric polarizability.…”

Section: Introductionmentioning

confidence: 99%

Improved capacitive energy storage performance in hybrid films with ultralow aminated molybdenum trioxide integration for high-temperature applications

Zeng,

Li,

Liu

et al. 2024

Mater. Horiz.

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High-temperature polymer dielectrics with superior capacitive energy storage performance

Cited by 24 publications

References 42 publications

Significant Enhancement in Dielectric Properties of Polyimide Alloys Through a Two‐Phase Interlocking Structure

Significant Enhancement in Dielectric Properties of Polyimide Alloys Through a Two‐Phase Interlocking Structure

Aromatic‐Free Polymers Based All‐Organic Dielectrics with Breakdown Self‐Healing for High‐Temperature Capacitive Energy Storage

Improved capacitive energy storage performance in hybrid films with ultralow aminated molybdenum trioxide integration for high-temperature applications

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