2018
DOI: 10.1016/j.microrel.2017.10.036
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High temperature storage reliability of palladium coated copper wire in different EFO current settings

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Cited by 2 publications
(5 citation statements)
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“…The dark gray area in Figure 9 is the Pd coverage area. Cheng et al [38] studied the effect of different EFO discharge currents (50, 70, and 90 mA) on the distribution of Pd on FAB using 18 µm PdCu wire (99.99 wt. % purity of copper, 0.1 µm thickness of Pd layer).…”
Section: The Distribution Of Pd In Fab and Bonding Interfacementioning
confidence: 99%
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“…The dark gray area in Figure 9 is the Pd coverage area. Cheng et al [38] studied the effect of different EFO discharge currents (50, 70, and 90 mA) on the distribution of Pd on FAB using 18 µm PdCu wire (99.99 wt. % purity of copper, 0.1 µm thickness of Pd layer).…”
Section: The Distribution Of Pd In Fab and Bonding Interfacementioning
confidence: 99%
“…Stephan et al [20] used a 15 µm PdCu wire to test under different EFO discharge currents (40, 60, and 80 mA), and then studied the distribution of Pd on the FAB surface by optical imaging of the FAB surface through the bright field imaging technique. From Figure 10, it can be seen that as the EFO discharge current increases, the Pd coverage on the FAB projection surface Cheng et al [38] studied the effect of different EFO discharge currents (50, 70, and 90 mA) on the distribution of Pd on FAB using 18 µm PdCu wire (99.99 wt. % purity of copper, 0.1 µm thickness of Pd layer).…”
Section: The Distribution Of Pd In Fab and Bonding Interfacementioning
confidence: 99%
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