High thermal conductivity aluminium nitride –zirconium diboride (AlN-ZrB2) composite as microwave absorbing material

Patel, Manish; Reddy, J. Janardhana; Prasad, V.V. Bhanu

doi:10.1016/j.ceramint.2021.04.206

Cited by 16 publications

(1 citation statement)

References 36 publications

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“…With the rapid development of microelectronic techniques, chips are becoming smaller and more integrated, and computing speed is becoming faster. − Consequently, a significant amount of heat generates in chips with a small volume, causing the reduction of operating stability and service life. , Heat dissipation has become a critical issue for electronic packing materials. , This problem is usually addressed by the bonding of thermal interface materials (TIMs) between the chips and the heat spreader to transfer the heat generated from the operation of chips, thereby ensuring proper operation of chips. , Polymer materials have been widely applied in the area of TIMs due to their good mechanical properties, electric insulation, convenient durability, and easy processability. − However, the thermal conductivities of polymers are not good (about 0.2–0.5 W m K –1 ). To improve the heat conduction performance, thermally conductive fillers are incorporated into the polymer matrix, including BN, AlN, Al 2 O 3 , CNT, and GNP, in which the thermal resistance between fillers is considerable that decreasing the heat conduction efficiency seriously. Furthermore, when the conductor fillers are selected as thermally conductive fillers, the insulation of the polymer resin would be destroyed if the content of fillers exceeds the critical value.…”

Section: Introductionmentioning

confidence: 99%

Graphene/Polyolefin Elastomer Films as Thermal Interface Materials with High Thermal Conductivity, Flexibility, and Good Adhesion

Sun

Wang

et al. 2023

Chem. Mater.

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Heat dissipation has become a central issue for the development of the microelectronic industry. Thermal interface materials (TIMs) have been widely applied to electron component cooling, which is used to bond the heat spreader and the chip together. Most research on TIMs has only dealt with thermal conductivity enhancement. However, the mechanical properties and adhesion of TIMs are indispensable for practical applications, as well as postcleaning to remove TIMs. A graphene nanosheet/polyolefin elastomer (GNP/POE) film was designed and prepared by a facile method, in which the heat conduction paths were efficiently constructed, and the good mechanical properties of POE were reserved. The thermal conductivity of as-prepared GNP/POE film can reach 1.07 W m −1 K −1 at an extremely low filler loading of 0.62 wt %. Furthermore, the tensile strength, elongation at break, and adhesion of the prepared GNP/POE film are as good as those of commercial TIM productions. The prepared GNP/POE film can be used as TIMs for chip cooling and exhibits a good heat dissipation effect. Additionally, the prepared GNP/POE film can be peeled off from the chip without residue, after the chip has finished running, which is significant for practical production. This work provides valuable information and insight into the design and fabrication of TIMs in the future.

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Section: Introductionmentioning

confidence: 99%

Graphene/Polyolefin Elastomer Films as Thermal Interface Materials with High Thermal Conductivity, Flexibility, and Good Adhesion

Sun

Wang

et al. 2023

Chem. Mater.

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Preparation of h‐BN/PMMA composites by in situ polymerization and research on their structure and properties

Wu,

Wang,

Gao

et al. 2024

Polymer Composites

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Inorganic fillers like hexagonal boron nitride (h‐BN) have the potential to enhance the thermal conductivity of polymer mixtures. However, it has been restricted due to poor dispersion of particles in polymer matrices by melt mixing process. The addition of inorganic powders into sticky prepolymer is expected to alleviate the aggregation of powders. In this paper, h‐BN/polymethyl methacrylate (PMMA) composites were prepared by in situ polymerization of methyl methacrylate (MMA) with 5 and 20 μm of h‐BN particle as fillers respectively, for even distribution of fillers with in composites. The structures and properties of composites were characterized by FT‐IR, DSC, TGA, SEM, laser thermal conductivity meter and universal electronic tester. By SEM, it can be seen that a highly uniform dispersion of h‐BN in PMMA. When the mass fraction of h‐BN is 20 wt%, the thermal conductivity of the composites is increased by 107% for 5 μm h‐BN and 189% for 20 μm h‐BN, respectively. With the mass constituting of 5 wt% h‐BN, majority of mechanical characteristics of the composite, such as tensile strength, tensile modulus, along with impact strength, are enhanced, alongside a decrease in bending strength. This work would provide a filling strategy of h‐BN into the polymer matrices to achieve uniform dispersion, and enhance both the thermoconductivity and mechanical strength of thermoplastic composites.Highlights A technique for creating h‐BN/PMMA composites using in suit redox polymerization. Ehancing the thermal conductivity of these composites is achievable through the even distribution of h‐BN flakes within the PMMA matrix. It provides a reference for the design of future h‐BN/PMMA composites with favorable the thermal conductivity which achieves a good balance between performance and cost.

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An Ultra‐Broadband Electromagnetic Wave Absorbing ZrB₂‐Based Ceramic Composite Inspired by Barbule of Peacock

Dai,

Jia,

Deng

et al. 2024

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Broadband electromagnetic wave (EMW) absorbing ceramic materials are highly required for the thermal parts of aerocraft. As members of ultrahigh temperature ceramics, ZrB2‐based ceramics have great potential for applications in more extreme environments relative to the currently used silicon‐based and oxide‐based ceramics. However, ZrB2 is not among the traditional EMW absorbing material candidates due to its high conductivity, which induces the strong reflection of EMW due to the impedance mismatch with free space. Herein, ZrB2‐based ceramic with a bionic microstructure inspired by peacock barbules is proposed. Boron nitride nanotubes acting as polarization centers inside the ZrB2‐based material cause massive EMW dissipation. The ceramic shows an ultra‐broadband absorption of 9.6 GHz (<−10 dB from 8.4 to 18 GHz), almost covering the entire X and Ku bands, superior to the reported ceramics. The polarization centers successfully turn the ZrB2‐based ceramic from EMW reflecting material to an excellent EMW absorbing material by the bionic barbule interspersed microstructure. The simulated metamaterial of the ceramic achieves an ultra‐broad absorption (lower than −15 dB) in the range of 2–40 GHz. This work provides valuable insights for the development of broadband absorption material for high‐temperature environments.

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High thermal conductivity aluminium nitride –zirconium diboride (AlN-ZrB2) composite as microwave absorbing material

Cited by 16 publications

References 36 publications

Graphene/Polyolefin Elastomer Films as Thermal Interface Materials with High Thermal Conductivity, Flexibility, and Good Adhesion

Graphene/Polyolefin Elastomer Films as Thermal Interface Materials with High Thermal Conductivity, Flexibility, and Good Adhesion

Preparation of h‐BN/PMMA composites by in situ polymerization and research on their structure and properties

An Ultra‐Broadband Electromagnetic Wave Absorbing ZrB₂‐Based Ceramic Composite Inspired by Barbule of Peacock

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High thermal conductivity aluminium nitride –zirconium diboride (AlN-ZrB2) composite as microwave absorbing material

Cited by 16 publications

References 36 publications

Graphene/Polyolefin Elastomer Films as Thermal Interface Materials with High Thermal Conductivity, Flexibility, and Good Adhesion

Graphene/Polyolefin Elastomer Films as Thermal Interface Materials with High Thermal Conductivity, Flexibility, and Good Adhesion

Preparation of h‐BN/PMMA composites by in situ polymerization and research on their structure and properties

An Ultra‐Broadband Electromagnetic Wave Absorbing ZrB2‐Based Ceramic Composite Inspired by Barbule of Peacock

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Product

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An Ultra‐Broadband Electromagnetic Wave Absorbing ZrB₂‐Based Ceramic Composite Inspired by Barbule of Peacock