High thermal conductivity and strong interface bonding of a hot-forged Cu/Ti-coated-diamond composite

Liu, Lei; Bolzoni, Leandro; Yang, Fei

doi:10.1016/j.carbon.2020.07.001

Cited by 67 publications

(15 citation statements)

References 58 publications

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“…Compared to other fabrication methods, powder forging can rapidly and cost-effectively prepare copper/diamond composites without using expensive manufacturing equipment, and it offers an alternative and potentially more effective fabrication method for producing copper/diamond composites. Yang et al first applied the powder forging technique to producing copper/diamond composites from the powder mixture of artificial diamond and elemental copper powders [61][62][63][64]. The carbide-forming elements such as titanium and chromium are introduced in the materials system via adding alloying element powders in the powder mixture or precoated the alloying element on the diamond particle surface.…”

Section: Powder Forging Methodsmentioning

confidence: 99%

“…However, the formation of a thin amorphous carbon layer (for the 1050°C forged composite [61]) in the diamond particle (next to the interfacial layer) and deformed structure in the copper matrix have an adverse effect on the thermal conductivity of the formed composites. The hot-forged copper-55 vol% diamond (coated with Ti) composite shows a high thermal conductivity of 550 W/mÁK and a CTE of 7 ppm/K at 313 K, and a flexural strength of 418 MPa [62]. These results are better than those of most reported copper/diamond composites (with the diamond particle size of \ 100 lm), suggesting that the powder forging technique is feasible to produce a copper/diamond composite with an acceptable mechanical and thermo-physical performance for practical applications.…”

Section: Powder Forging Methodsmentioning

confidence: 99%

“…24a), thus increasing the interfacial bonding strength, and this is more beneficial for obtaining high TBC compared to the planar TiC interface layer in Fig. 24b [62].…”

Section: Thermal Boundary Conductancementioning

confidence: 99%

“…Due to its concise form and simplicity, the DEM model is applied in many works related to copper/diamond composite materials [6,7,19,87,127]. Yang et al find that the Cu/diamond composite with Ti additive can reach 99% of the predicted value (555 W/m K) by the DEM model [62]. In another work, the DEM model can give an upper bound for the prediction of thermal conductivity of copper/diamond composites, based on the TDTR-measured TBC value G, as shown in Fig.…”

Section: Differential Effective Medium (Dem) Modelmentioning

confidence: 99%

“…Sketch of toughening and reinforcing mechanisms for a 800-Cu/ 55Dia composite and b 1050C-Cu/55Dia composite; and schematic illustration of heat transport in c 800C-Cu/55Dia composite and d 1050-Cu/55Dia composite[62].…”

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confidence: 99%

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High thermal conductive copper/diamond composites: state of the art

Jia

Yang

2020

J Mater Sci

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Copper/diamond composites have drawn lots of attention in the last few decades, due to its potential high thermal conductivity and promising applications in high-power electronic devices. However, the bottlenecks for their practical application are high manufacturing/machining cost and uncontrollable thermal performance affected by the interface characteristics, and the interface thermal conductance mechanisms are still unclear. In this paper, we reviewed the recent research works carried out on this topic, and this primarily includes (1) evaluating the commonly acknowledged principles for acquiring high thermal conductivity of copper/diamond composites that are produced by different processing methods; (2) addressing the factors that influence the thermal conductivity of copper/diamond composites; and (3) elaborating the interface thermal conductance problem to increase the understanding of thermal transferring mechanisms in the boundary area and provide necessary guidance for future designing the composite interface structure. The links between the composite’s interface thermal conductance and thermal conductivity, which are built quantitatively via the developed models, were also reviewed in the last part.

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Section: Powder Forging Methodsmentioning

confidence: 99%

Section: Powder Forging Methodsmentioning

confidence: 99%

“…24a), thus increasing the interfacial bonding strength, and this is more beneficial for obtaining high TBC compared to the planar TiC interface layer in Fig. 24b [62].…”

Section: Thermal Boundary Conductancementioning

confidence: 99%

Section: Differential Effective Medium (Dem) Modelmentioning

confidence: 99%

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confidence: 99%

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High thermal conductive copper/diamond composites: state of the art

Jia

Yang

2020

J Mater Sci

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High‐Strength Wear‐Resistant Cu/Tungsten Carbide/Diamond Composites Fabricated by Powder Metallurgy

Zhang,

Lei,

Gao

et al. 2024

Adv Eng Mater

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Copper‐based diamond composites are widely used for thermal management and wear‐resistant materials. In this work, Cu/diamond, Cu/WC/diamond, and Cu‐0.92Cr/WC/diamond composites were fabricated by high‐energy ball milling and rapid hot‐pressing sintering. Physical characteristics, compressive strength, and tribological properties of the studied composites were investigated. The compressive strength of Cu/7wt.%WC/diamond composites was 102% higher than the Cu/diamond composites, reaching 415 MPa. Compression fractures extended from the interface due to compression cracks, consistent with the compression curves from molecular dynamics simulations. The crack propagated from the interface during the compression experiment, which was consistent with the result of molecular dynamics simulation. The Cu/7wt.%WC/diamond composites exhibited a wear rate of 0.6×10‐6 mm3/(N·m) and a friction coefficient of 0.37. at 50 N. The addition of WC and diamond improves the compressive strength and wear resistant. These findings were helpful in the development of copper composites with high compression strength and wear resistant.This article is protected by copyright. All rights reserved.

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Understanding on the Correlation between Mechanical Properties and Thermal Conductivity of Hot‐Forged Copper/Diamond Composites

Jia,

Ma,

Bolzoni

et al. 2024

Adv Eng Mater

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Evaluation of the mechanical properties of copper/diamond composites is necessary for understanding the interfacial bonding, which is important for the interface thermal conductance and thermal conductivity of the composites. The tensile and three‐point bending tests are conducted on the hot‐forged copper/diamond composites using Cr powder additives and Cr‐coated diamond. The interfacial bonding strength of the composites is calculated and evaluated based on the tensile results. The fracture mechanisms of the fabricated copper/diamond composites are discussed and compared. The highest tensile strength (69 MPa) and interface bonding strength (0.043 J m−2) are achieved for the Cu–3Cr‐55vol% diamond composite hot‐forged under 1050 °C. The connection between the composite's interfacial bonding strength and its thermal conductivity is elaborated.

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High thermal conductivity and strong interface bonding of a hot-forged Cu/Ti-coated-diamond composite

Cited by 67 publications

References 58 publications

High thermal conductive copper/diamond composites: state of the art

High thermal conductive copper/diamond composites: state of the art

High‐Strength Wear‐Resistant Cu/Tungsten Carbide/Diamond Composites Fabricated by Powder Metallurgy

Understanding on the Correlation between Mechanical Properties and Thermal Conductivity of Hot‐Forged Copper/Diamond Composites

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