High yield four-point bend thin film adhesion testing techniques

Birringer, Ryan P.; Chidester, Paula J.; Dauskardt, Reinhold H.

doi:10.1016/j.engfracmech.2011.05.010

Cited by 27 publications

(10 citation statements)

References 14 publications

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“…In that case Γ and G 0 would be equal. Measuring Γ as a function of the environment would also be beneficial, although these measurements can be challenging for such thin coatings [32]. For applications such as flexible and stretchable electronics mentioned in the introduction, the fatigue degradation properties of ALD titania should be directly characterized on soft substrates to account for the importance of substrate's compliance (and roughness) on the strain energy release rate calculations, their critical values (especially Γ), and the corresponding crack growth rates.…”

Section: Resultsmentioning

confidence: 99%

Comparison of the cohesive and delamination fatigue properties of atomic-layer-deposited alumina and titania ultrathin protective coatings deposited at 200 °C

Sadeghi-Tohidi

Samet

Graham

et al. 2014

Science and Technology of Advanced Materials

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The fatigue properties of ultrathin protective coatings on silicon thin films were investigated. The cohesive and delamination fatigue properties of 22 nm-thick atomic-layered-deposited (ALD) titania were characterized and compared to that of 25 nm-thick alumina. Both coatings were deposited at 200 °C. The fatigue rates are comparable at 30 °C, 50% relative humidity (RH) while they are one order of magnitude larger for alumina compared to titania at 80 °C, 90% RH. The improved fatigue performance is believed to be related to the improved stability of the ALD titania coating with water compared to ALD alumina, which may in part be related to the fact that ALD titania is crystalline, while ALD alumina is amorphous. Static fatigue crack nucleation and propagation was not observed. The underlying fatigue mechanism is different from previously documented mechanisms, such as stress corrosion cracking, and appears to result from the presence of compressive stresses and a rough coating–substrate interface.

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Section: Resultsmentioning

confidence: 99%

Comparison of the cohesive and delamination fatigue properties of atomic-layer-deposited alumina and titania ultrathin protective coatings deposited at 200 °C

Sadeghi-Tohidi

Samet

Graham

et al. 2014

Science and Technology of Advanced Materials

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“…For mechanical strength characterization of interfaces, the four point bending test is widely used [1][2][3]. Typically, this is done by depositing a thin film stack on a substrate and gluing the other end to an identical substrate.…”

Section: A Adhesion Characterization By Four Point Bending Testmentioning

confidence: 99%

Delamination in BEOL: Analysis of interface failure by combined experimental & modeling approaches

Debecker

Vanstreels

González

et al. 2013

2013 IEEE International Reliability Physics Symposium (IRPS)

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It is demonstrated that the widely used equation to derive the adhesive strength from the external load in a 4 point bending test has a certain error by taking only the substrate's elastic parameters into account. Next to this, failure location analysis gives insight on the measured variation of adhesive strength for the same interface. Subsequently, with numerical simulations, the adhesive strength can be separated in its different energy modes, allowing a better understanding and characterization of the experimental observations (e.g. higher cohesive energy for increasing low-k stiffness). Finally, the competing failure mechanisms within the BEOL are identified as necessary qualifiers for BEOL failure assessment, where currently adhesion strength is mainly used for ranking the performance of different BEOL interfaces.

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“…After applying significant force, small pieces at the edge would chip off, cracking through the silicon bulk rather than the interface. 22 Measuring adhesion or bond strength in ductile films is often difficult, 23 and the fracture energy of the subeutectic 400 C Al-Ge bond may have been greater than could be successfully measured using specimens fabricated from the brittle Si substrates used in this study. 19 The measurement was performed on 40 mm long and 4 mm wide beams cut out from eutectically bonded wafers at 435 C with deposited Al-Ge layer thickness of 318 nm.…”

Section: A Characterization Of the Al-ge Bondsmentioning

confidence: 99%

Low-temperature Al–Ge bonding for 3D integration

Crnogorac

Pease

Birringer

et al. 2012

Journal of Vacuum Science &Amp; Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phen

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Low-temperature aluminum-germanium (Al-Ge) bonding has been investigated for monolithic three-dimensional integrated circuit (3DIC) applications. As upper layer devices of a monolithic 3DIC are fabricated in situ, a suitable technique for providing high-quality semiconducting material without inflicting damage to underlying circuits below is needed. Here, the authors demonstrate a method of attaching high-quality single-crystal Si (100) and Ge (100) islands (3-3000 lm in size) onto amorphous SiO 2 substrates using both eutectic (435 C) and subeutectic (400 C) Al-Ge bonding. The 30 min, 3DIC compatible process utilizes Al-Ge bilayer films as thin as 157 nm to form void-free bonds strong enough to withstand SmartCut V R hydrogen splitting of the donor wafer. The fracture energy of the Al-Ge bond was measured to be G C ¼ 50.5 6 12.7 J/m 2 , as measured by the double cantilever beam thin-film adhesion measurement technique.

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High yield four-point bend thin film adhesion testing techniques

Cited by 27 publications

References 14 publications

Comparison of the cohesive and delamination fatigue properties of atomic-layer-deposited alumina and titania ultrathin protective coatings deposited at 200 °C

Comparison of the cohesive and delamination fatigue properties of atomic-layer-deposited alumina and titania ultrathin protective coatings deposited at 200 °C

Delamination in BEOL: Analysis of interface failure by combined experimental & modeling approaches

Low-temperature Al–Ge bonding for 3D integration

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High yield four-point bend thin film adhesion testing techniques

Cited by 27 publications

References 14 publications

Comparison of the cohesive and delamination fatigue properties of atomic-layer-deposited alumina and titania ultrathin protective coatings deposited at 200 °C

Comparison of the cohesive and delamination fatigue properties of atomic-layer-deposited alumina and titania ultrathin protective coatings deposited at 200 °C

Delamination in BEOL: Analysis of interface failure by combined experimental &amp; modeling approaches

Low-temperature Al–Ge bonding for 3D integration

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Delamination in BEOL: Analysis of interface failure by combined experimental & modeling approaches