Highly-enhanced reflow characteristics of sputter deposited Cu interconnections of large scale integrated devices by optimizing sputtering conditions

Abstract

Improving the reflow characteristics of sputtered Cu films was attempted by optimizing the sputtering conditions. The reflow characteristics of films deposited under various sputtering conditions were evaluated by measuring their filling level in via holes. It was found that the reflow characteristics of the Cu films are strongly influenced by the deposition parameters. Deposition at low temperatures and the addition of H2 or N2 to the Ar sputtering gas had a significant influence on the reflow characteristics. Imperfections in the Cu films before and after the high-temperature, high-pressure treatments were investigated by positron annihilation spectroscopy. The results showed that low temperature and the addition of H2 or N2 led to films containing a large number of mono-vacancies, which accelerate atomic diffusion creep and dislocation core diffusion creep, improving the reflow characteristics of the Cu films.