Extended Abstracts of the 2005 International Conference on Solid State Devices and Materials 2005
DOI: 10.7567/ssdm.2005.h-4-3
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Highly Reliable 256Mb NOR Flash MLC with Self-Aligned Process and Controlled Edge Profile

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“…In this study, in order to extract metallic components from used PCB, a high temperature melting process was adopted, and for this purpose a quaternary Xwt%SiO 2 -20wt%Al 2 O 3 -Ywt%CaO-10wt%MgO slag system was selected, which was determined based on a phase diagram using the results of quantitative analysis of oxidized electronic scrap [5]. Since SiO 2 and Al 2 O 3 were major components in the oxidized electronic scrap, which have an influence upon the slag fluidity by forming a silicate network chain, it was found that a relatively low temperature and a low viscosity slag could be obtained by the addition of basic fluxes such as CaO and MgO.…”
Section: Introductionmentioning
confidence: 99%
“…In this study, in order to extract metallic components from used PCB, a high temperature melting process was adopted, and for this purpose a quaternary Xwt%SiO 2 -20wt%Al 2 O 3 -Ywt%CaO-10wt%MgO slag system was selected, which was determined based on a phase diagram using the results of quantitative analysis of oxidized electronic scrap [5]. Since SiO 2 and Al 2 O 3 were major components in the oxidized electronic scrap, which have an influence upon the slag fluidity by forming a silicate network chain, it was found that a relatively low temperature and a low viscosity slag could be obtained by the addition of basic fluxes such as CaO and MgO.…”
Section: Introductionmentioning
confidence: 99%
“…Recently, the control of the edgeprofile of the tunnel oxide in 90-nm NOR Flash memory cells was shown to improve V T distribution [10], [11], indicating that the edge geometry also affects V T .…”
Section: Introductionmentioning
confidence: 99%