Highly reliable nickel-tin transient liquid phase bonding technology for high temperature operational power electronics in electrified vehicles

Yoon, Sang Won; Shiozaki, Koji; Yasuda, Satoshi; Glover, Michael D.

doi:10.1109/apec.2012.6165863

Cited by 20 publications

(8 citation statements)

References 14 publications

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“…Transient Liquid Phase Bonding (TLPB) realized by bonding of parent materials with pre-deposited low-melting metal layer, whereas Transient Liquid Phase Soldering (TLPS) involves usage of the printed standard soft solders as interlayer for intermetallic phase (IMP) formation [77], [86]- [89]. The diffusion solder have Ag/In [90], [91], Ag/Sn [92], Au/In [93], [94], Au/ Sn [95], [96], Cu/Sn [97], [98], and Ni/Sn [99]. Considered the cost and environment friendly, the Cu-Sn alloy solder has been a good candidate for high temperature applications.…”

Section: Au100mentioning

confidence: 99%

A Review of SiC Power Module Packaging: Layout, Material System and Integration

2017

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Abstract-Silicon-Carbide (SiC) devices with superior performance over traditional silicon power devices have become the prime candidates for future high-performance power electronics energy conversion. Traditional device packaging becomes a limiting factor in fully realizing the benefits offered by SiC power devices, and thus, improved and advanced packaging structures are required to bridge the gap between SiC devices and their applications. This paper provides a review of the state-of-art advanced module packaging technologies for SiC devices with the focuses on module layout, packaging material system, and module integration trend, and links these packaging advancements to their impacts on the SiC device performances. Through this review, the paper discusses main challenges and potential solutions for SiC modules, which is critical for future SiC applications.Index Terms-Packaging material system, power module integration, SiC advanced packaging.

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Section: Au100mentioning

confidence: 99%

A Review of SiC Power Module Packaging: Layout, Material System and Integration

2017

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“…In the microelectronic packaging, nickel-based metallization schemes have been widely used, and the most common fabrication technique used is transient liquid phase (TLP) bonding. Considering some aspects such as bonding strength and fabrication cost, IMCs generated during low-temperature bonding are widely favored because of the excellent bonding strength of solder joints [ 5 , 6 , 7 , 8 ]. It has been reported that the diffusion rate of Ni into solder at high temperatures in c -axis direction is four orders greater than that in a -axis or b -axis [ 9 ].…”

Section: Introductionmentioning

confidence: 99%

Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints

et al. 2022

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In this study, symmetrical solder joints (Cu/Ni/SnAg2.3/Ni/Cu) were fabricated. They were electromigration (EM)-stressed at high (8 × 104 A/cm2) or low (1.6 × 104 A/cm2) current densities. Failures in the solder joints with different grain orientations under EM stressing were then characterized. Results show that Ni under-bump-metallurgy (UBM) was quickly dissolved into the solder joints possessing low angles between Sn c-axis and electron direction and massive NiCuSn intermetallic compounds formed in the Sn matrix. The diffusion rate of Ni increased with decreasing orientation grain angle. A theoretical model was also established to analyze the consumption rate of Ni UBM. Good agreement between the modeling and experimental results was obtained. Additionally, we found that voids were more likely to form in the solder joints under high EM stressing.

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“…Two different TLPS approaches for Cu-Sn and Ni-Sn systems have been introduced: A layer-based approach with a layer of low-melting temperature constituent sandwiched between layers of high-melting temperature constituents, and a paste-based approach which utilizes sinter pastes that consists of particles of high and low-melting temperature constituents. Considerable research on layer-based TLPS approaches has been published for Cu-Sn [2][3][4][5][6][7] and Ni-Sn [8][9][10][11][12]. Detrimental to this approach is that bondline thicknesses are limited to thin joints: IMC growth is a diffusion-driven process, and the layer thickness is proportional to the square root of time.…”

Section: Introductionmentioning

confidence: 99%

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermomechanical Simulation

Greve

Moeini

McCluskey

et al. 2018

Journal of Electronic Packaging

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Transient liquid phase sintering (TLPS) is a novel high-temperature attach technology. It is of particular interest for application as die attach in power electronic systems because of its high-melting temperature and high thermal conductivity. TLPS joints formed from sinter pastes consist of metallic particles embedded in matrices of intermetallic compounds (IMCs). Compared to conventional solder attach, TLPS joints consist to a considerably higher percentage of brittle IMCs. This raises the concern that TLPS joints are susceptible to brittle failure. In this paper, we describe and analyze the cooling-induced formation of vertical cracks as a newly detected failure mechanism unique to TLPS joints. In a power module structure with a TLPS joint as interconnect between a power device and a direct bond copper (DBC) substrate, cracks can form between the interface of the DBC and the TLPS joint when large voids are located in the proximity of the DBC. These cracks do not appear in regions with smaller voids. A method has been developed for the three-dimensional (3D) modeling of paste-based TLPS sinter joints, which possess complex microstructures with heterogeneous distributions of metal particles and voids in IMC matrices. Thermomechanical simulations of the postsintering cooling process have been performed and the influence of microstructure on the stress-response within the joint and at the joint interfaces have been characterized for three different material systems (Cu þ Cu 6 Sn 5 , Cu þ Cu 3 Sn, Ni þ Ni 3 Sn 4 ). The maximum principal stress within the assembly was found to be a poor indicator for prediction of vertical crack formation. In contrast, stress levels at the interface between the TLPS joint and the power substrate metallization are good indicators for this failure mechanism. Small voids lead to higher joint maximum principal stresses, but large voids induce higher interfacial stresses, which explain why the vertical cracking failure was only observed in joints with large voids.

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Highly reliable nickel-tin transient liquid phase bonding technology for high temperature operational power electronics in electrified vehicles

Cited by 20 publications

References 14 publications

A Review of SiC Power Module Packaging: Layout, Material System and Integration

A Review of SiC Power Module Packaging: Layout, Material System and Integration

Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermomechanical Simulation

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