2011
DOI: 10.1016/j.snb.2011.01.035
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Highly sensitive polysilicon wire sensor for DNA detection using silica nanoparticles/γ-APTES nanocomposite for surface modification

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Cited by 33 publications
(19 citation statements)
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“…To overcome and solve such drawbacks, technological solutions have been envisioned and tested like the, immobilization of specific probes and/or biomolecules onto the gate-dielectric surface. This alternative approach was successfully developed for the fabrication of bio-FETs (biologically modified field-effect transistors) with the use and grafting of biomolecules (Uslu, 2004;Wu, 2011;Tatikonda, 2013;Hammock, 2013;Lee, 2009b), leading to sensors with higher specificity and selectivity.…”
Section: Introductionmentioning
confidence: 99%
“…To overcome and solve such drawbacks, technological solutions have been envisioned and tested like the, immobilization of specific probes and/or biomolecules onto the gate-dielectric surface. This alternative approach was successfully developed for the fabrication of bio-FETs (biologically modified field-effect transistors) with the use and grafting of biomolecules (Uslu, 2004;Wu, 2011;Tatikonda, 2013;Hammock, 2013;Lee, 2009b), leading to sensors with higher specificity and selectivity.…”
Section: Introductionmentioning
confidence: 99%
“…Polysilicon was chosen for its ability to withstand high temperatures and its high compatibility with standard semiconductor processing steps. The advantages of this material also include high sensitivity, a fast response time and high accuracy, as previously reported [ 34 , 35 ]. In the quest to reduce the use of expensive equipment, a conventional lithography microfabrication technique was implemented; this technique can be used to fabricate simple and non-complex nanostructures such as nanogaps and nanowires [ 36 , 37 ].…”
Section: Introductionmentioning
confidence: 62%
“…However, to fabricate microfluidic chips, the open microchannels need to be sealed. A number of different bonding techniques such as APTES bonding [9,10], thermal bonding [11][12][13], solvent bonding [14,15] and microwave welding methods [16] have been reported in recent several years. Among these bonding methods, thermal bonding has attracted increasing interests due to its simple and low-cost characters.…”
Section: Introductionmentioning
confidence: 99%