Highly Thermally Conductive Polyimide Composites via Constructing 3D Networks

Abstract

Easy and high efficient methods are in great demand to obtain polyimide (PI) composites with high thermal conductivity in the electronic packaging field. In this work, PI/boron nitride (BN) composites with high thermal conductivity are easily fabricated. Tightly connected and well‐arranged BN platelets construct effective 3D thermally conductive networks in the PI matrix upon hot pressing, after BN platelets are coated on the surface of PI granules by the help of a kind of PI adhesive. The thermal conductivity of the PI/BN composites reaches as high as 4.47 W mK–1 at a low BN loading of 20 vol%, showing an enhancement of 2099%, compared to pure PI. Such enhancement of the thermal conductivity is the highest compared with the results in the open literature. Our work is a good example that utilized the sufficient physical connection (aggregates) of thermally conductive fillers to significantly promote the thermal conductivity of polymer composites.

Novolac/Phenol-Containing Phthalonitrile Blends: Curing Characteristics and Composite Mechanical Properties

“…The distinguished comprehensive performance of these composites is conductive for pervasive application in marine, aerospace, radiation shielding, and electronic fields [1][2][3][4][5]. The common resin matrix for advanced composites are epoxy [6,7], polyimide [8][9][10], polyetheretherketone [11,12], and the best heat-resistant resin during last four decades-phthalonitrile [13][14][15][16][17].…”

Polydopamine-Modified Al2O3/Polyurethane Composites with Largely Improved Thermal and Mechanical Properties

“…Common thermally used conductive fillers are metals (Ag [8] and Cu [9]), carbon-based (graphene [10], carbon nanotubes [11]), and ceramics (BN [12], Al 2 O 3 [13], and AlN [14,15]). Metal fillers and carbon-based fillers also increase electrical conductivity while improving mechanical and thermal properties; however, they are disadvantageous for Insulation properties of thermal interface materials.…”

“…Generally speaking, poor interface combination between a thermal conductivity filler and polymer matrix leads to poor dispersion of the filler. These all cause strong phonon scattering and reduce phonon transmission efficiency, and then lead to the poor thermal conductivity of the interface [12,18,20,27,28]. It is reported that surface modification and functionalization of the filler can improve compatibility with the polymer matrix [29,30].…”

“…In order to realize insulating composites with high thermal conductivity and mechanical properties, a high load of spherical Al 2 O 3 particles are required. However, if the filler cannot be uniformly dispersed in the matrix and has good compatibility with the matrix, accumulation and pores will be formed, which will reduce the mechanical properties of the composites [12,33,35]. Therefore, surface modification of the thermal conductivity filler under a high load can not only improve the thermal conductivity of the composites but also improve the mechanical properties.…”

In situsynthesis of MWCNT-graft-polyimides: thermal stability, mechanical property and thermal conductivity

“…In recent years, with the rapid development of highperformance microelectronic equipment and energy harvesting devices, the demand for heat sinks in industrial and electronic elds has dramatically increased. 1,2 However, the thermal conductivity of common polymers is quite low and ranges from 0.1 W m À1 K À1 to 0.3 W m À1 K À1 . Hence, their applications are severely limited in industrial and electronic elds due to heat accumulation.…”