Highly thermally conductive POSS-g-SiCp/UHMWPE composites with excellent dielectric properties and thermal stabilities

Role, effect, and influences of micro and nano‐fillers on various properties of polymer matrix composites for microelectronics: A review

“…Although the K value improvement of the fillers‐filled polymeric nanocomposites is often less than from expected, this is due to a high interfacial thermal resistance of polymer matrix/fillers could restrict the heat transport within the polymer nanocomposites. Gu J. M. et al adopted appropriate surface functionalization mechanism to achieve effective decrement of the interfacial thermal resistance between polymer matrix and conductive fillers. Moreover, to fabricate high‐K nanocomposites, the more quantity addition of fillers is generally performed in order to form active thermally conductive networks and channels, which can result in a big challenge of mechanical properties, cost, density, and processibility.…”

Preparation of open-porous stereocomplex PLA/PBAT scaffolds and correlation between their morphology, mechanical behavior, and cell compatibility

“…[14][15][16][17] Nanocomposites is another technology for the polymer modication with enhanced mechanical properties, antibacterial property and other multifunctionalizations. 18,19 Patrício et al toughened PLA scaffold by introducing high-toughness polycaprolactone (PCL) into scaffold matrix, 20 resulting in PLA/PCL composite scaffolds that possess better mechanical properties and biocompatibility. Also, Scaffaro et al 21 prepared porous PLA/polyethyleneglycol (PEG) scaffold, which showed lower elongation and enhanced hydrophilic properties, due to the abundant hydrophilic groups and exible PEG molecule.…”

A review on thermally conductive polymeric composites: classification, measurement, model and equations, mechanism and fabrication methods

“…Polymers possess light weight, high specific strength and modulus, excellent electrical insulating properties, good processability, excellent chemical stability, and low cost [1][2][3][4][5][6] and have been widely applied in the fields of electronics [7], biology [8], medicine [9], energy [10], and manufacturing industry [11], etc. Unfortunately, the intrinsic low thermally conductive coefficient (λ) and insufficient thermal stability of polymeric matrix have restricted its broader application in the areas which require good heat dissipation and low thermal expansion [12][13][14][15][16][17][18][19].…”