Hochempfindliche Folien-Dehnungsmessstreifen
auf dem Weg zur technologischen Reife

Vollberg, Dennis; Probst, Anne-Catherine; Langosch, Matthäus; Landes, A.; Göttel, Dirk; Cerino, M.; Lellig, Angela; Freitag-Weber, Olivia; Schultes, Günter

doi:10.1515/teme-2015-0066

Cited by 7 publications

(5 citation statements)

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“…Thin film strain gauges were produced according to Vollberg et al (2015). The piezoresistive, NiCr-C-based thin film (thickness of 150 nm) was deposited onto a polyimide carrier (thickness of 50 µm) via reactive sputter deposition.…”

Section: Experimental Realizationmentioning

confidence: 99%

“…Metal-carbon films with thicknesses of approx. 150 nm are based on granular Ni-C (Koppert et al, 2012) or NiCr-C (Vollberg et al, 2015). The highly sensitive foil SGs show different properties compared with conventional metal foil SGs, especially concerning the gauge factor values (Vollberg et al, 2015).…”

Section: Introductionmentioning

confidence: 99%

“…150 nm are based on granular Ni-C (Koppert et al, 2012) or NiCr-C (Vollberg et al, 2015). The highly sensitive foil SGs show different properties compared with conventional metal foil SGs, especially concerning the gauge factor values (Vollberg et al, 2015). Highly sensitive SGs can reach longitudinal gauge factors up to 30 (Schultes et al, 2018), allowing for the measurement of very small strains, which can be advantageous for stress analysis and sensor applications.…”

Section: Introductionmentioning

confidence: 99%

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Novel method to reduce the transverse sensitivity of granular thin film strain gauges by modification of strain transfer

Mathis¹,

Vollberg²,

Langosch³

et al. 2020

J. Sens. Sens. Syst.

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Abstract. Strain gauges based on polyimide carrier foils and piezoresistive granular thin films are highly sensitive to strain. Unlike conventional metal foil, granular film strain gauges also have a pronounced sensitivity to strain acting in the transverse direction. A novel method that allows for the modification of the strain transfer is proposed and proven experimentally. The method is based on the creation of stand-alone polyimide paths, on top of which the piezoresistive thin film is located. In this way, the granular film hardly receives any transverse strain; hence, the transverse sensitivity is drastically reduced. A picosecond laser system can be used for both patterning of the thin film and for controlled ablation of polyimide in order to generate well-defined high path structures. The working principle of the method is demonstrated by simulation, followed by an experimental verification using measurements of the transverse gauge factor. Furthermore, the output signal of force transducers may be increased using granular thin film strain gauges of reduced transverse sensitivity.

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Section: Experimental Realizationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Novel method to reduce the transverse sensitivity of granular thin film strain gauges by modification of strain transfer

Mathis¹,

Vollberg²,

Langosch³

et al. 2020

J. Sens. Sens. Syst.

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“…In the digital age of comprehensive health informatics, to realize continuous and real-time data collection throughout the day, lightweight and comfortable wearable sensors are indispensable . Soft and stretchable strain sensors, as one of the important elements in the family of wearable sensors, , have undergone development from traditional wire and/or foil strain gauges − to ultrathin-film-state strain sensors, for the purpose of making them respond simultaneously to the epidermic changes , and realizing precise detection . In addition, numerous contributions have been made to strain sensors by the use of newly developed materials, such as low-dimensional carbon materials, , biomass, , metal nanowires, , MXene fabric, , as well as hydrogels , and composites loaded with nanoconductive fillers, as well as the recently proposed crack-based strain sensors by imitating slit sensilla of arthropods .…”

Section: Introductionmentioning

confidence: 99%

Liquid Metal and Carbon Nanofiber-Based Strain Sensor for Monitoring Gesture, Voice, and Physiological Signals

Wang,

Ren,

Jia

et al. 2024

ACS Appl. Nano Mater.

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Fiber strain sensors are emerging as a focus in wearable monitors due to their excellent flexibility and weavability. However, a compromise of the detection range with sensitivity and hysteresis still exists in current fiber strain sensors. To overcome this deficiency, we propose a fiber strain sensor by using liquid metal (LM) and carbon nanofiber (CNF) composites (LM/CNF) as elastic and sensitive conductive materials and dip-coating it on a polyurethane elastic thread (PUT) by an ultrasonic-assisted method. It is demonstrated by morphological examination that there is an "island-bridge" like the network in the LM/CNF suspension and the coated LM/CNF on PUT by the ultrasonicassisted dip-coating technique. The good sensitivities in a wide strain range are testified (i.e., gauge factors (GFs) of 14.8 ± 0.5, 35.7 ± 2.3, and 73.7 ± 3.9 in the strain ranges of 0−110, 110−150, and 150−220%, respectively) and proven to be contributed by the entangled LM nanoparticles by CNF microrods. Meanwhile, the short response times (304 ± 26 ms for loading 20% strain and 315 ± 28 ms for unloading) and low hysteresis are also manifested. All of these good features endow the LM/CNF-based fiber strain sensor with the capability to simultaneously monitor human health state and body movements; this great potentiality is also demonstrated by the on-body detections of respiration, pulse, voice, and joint bending. Finally, its conceptual application as a smart glove for gesture recognition is also carried out. In general, this work manifests that the LM/CNF-based fiber strain sensors may be of practical value in the field of health and motion detection.

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“…Because of this difficulty, authors in the past have considered small substrate damage (e.g. 1 µm abrasion from a 50 µm polymer foil after ablating a 150 nm metallic thin film) inevitable to achieve proper electrical insulation [10]. As this is justified for some applications, it might limit the use of laser ablation processes when areal removal on transparent substrates should be accomplished (e.g.…”

Section: Introductionmentioning

confidence: 99%

Methodology of selective metallic thin film ablation from susceptible polymer substrate using pulsed femtosecond laser

et al. 2020

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Electronic devices on flexible polymeric substrates allow new fields of applications. A maskless and flexible structuring process for such systems is offered by ablation using ultra-short pulse laser irradiation. Hereby, certain areas of a functional thin film coating (e.g. nickel-chromium) are locally removed from a substrate (e.g. polyimide) to yield the needed device structures. Micro laser patterning quality is influenced by the beam properties (beam profile, fluence) as well as by the pulse overlap, the substrate material and many other factors. A clear distinction must be made between the material ablation at the surface of a bulk material and the substrate selective removal of a thin metallic film. For the latter, general rules for the prediction of ablation results especially in the case of areal ablation, which were not known from the literature so far, are derived here in the form of mathematical criteria. A methodology for the parameter finding in different cases of ablation (dot, line, areal) is presented and exemplified using a practical example, but is also applicable to other flexible thin film based systems.

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Hochempfindliche Folien-Dehnungsmessstreifen auf dem Weg zur technologischen Reife

Cited by 7 publications

References 0 publications

Novel method to reduce the transverse sensitivity of granular thin film strain gauges by modification of strain transfer

Novel method to reduce the transverse sensitivity of granular thin film strain gauges by modification of strain transfer

Liquid Metal and Carbon Nanofiber-Based Strain Sensor for Monitoring Gesture, Voice, and Physiological Signals

Methodology of selective metallic thin film ablation from susceptible polymer substrate using pulsed femtosecond laser

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