2006 IEEE 4th World Conference on Photovoltaic Energy Conference 2006
DOI: 10.1109/wcpec.2006.279781
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Hot Embossing of Polymer Substrates for Thin Silicon Cell Applications

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Cited by 5 publications
(4 citation statements)
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“…In the case of soft thermoplastic substrates, thermal nanoimprint lithography enabled replication of the mold patterns, however with a limited shape fidelity. In addition, the high pressure ( $ 200 bar) and high temperature ( $ 200 1C) [11] required to imprint the polymer surface could make it not cost effective [11][12][13]. Ultraviolet nanoimprint lithography (UVNIL) is a wellestablished process for the replication of sub-micron scale features into photopolymerizable resins.…”
Section: Introductionmentioning
confidence: 99%
“…In the case of soft thermoplastic substrates, thermal nanoimprint lithography enabled replication of the mold patterns, however with a limited shape fidelity. In addition, the high pressure ( $ 200 bar) and high temperature ( $ 200 1C) [11] required to imprint the polymer surface could make it not cost effective [11][12][13]. Ultraviolet nanoimprint lithography (UVNIL) is a wellestablished process for the replication of sub-micron scale features into photopolymerizable resins.…”
Section: Introductionmentioning
confidence: 99%
“…Recently, embossing has been proposed as alternate texturing method 13–17. In this contribution we present a process for the replication of given surface textures to rigid glass and also to flexible substrates as poly‐ethylene‐naphtalate (PEN; T G ≈ 120°C), using a transparent, UV‐curable lacquer.…”
Section: Introductionmentioning
confidence: 99%
“…Several methods are available for correlating the texture morphology with the solar cell properties. [16][17][18][19][20] In this report, we focus on the distribution of texture shapes. 21) Figure 1 shows a portion of the height data for rectangular coordinates of the texture surface, as measured by AFM.…”
Section: Methodsmentioning
confidence: 99%