2017 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED) 2017
DOI: 10.1109/islped.2017.8009191
|View full text |Cite
|
Sign up to set email alerts
|

Hotspot monitoring and Temperature Estimation with miniature on-chip temperature sensors

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1

Citation Types

0
3
0

Year Published

2018
2018
2022
2022

Publication Types

Select...
4
2

Relationship

0
6

Authors

Journals

citations
Cited by 8 publications
(3 citation statements)
references
References 20 publications
0
3
0
Order By: Relevance
“…For dynamic thermal management, temperature sensors are essential and are deployed in chips in a wide range [40]. The accuracy and number of temperature sensors can be ever improved in the future [41]. The attackers (being the TCC transceiver) are able to read or reach the local thermal sensor data by calling the software interfaces such as MSR or Intel's processor Model Specific Register, with a normal resolution of 1 • C [42].…”
Section: Threat Modelmentioning
confidence: 99%
“…For dynamic thermal management, temperature sensors are essential and are deployed in chips in a wide range [40]. The accuracy and number of temperature sensors can be ever improved in the future [41]. The attackers (being the TCC transceiver) are able to read or reach the local thermal sensor data by calling the software interfaces such as MSR or Intel's processor Model Specific Register, with a normal resolution of 1 • C [42].…”
Section: Threat Modelmentioning
confidence: 99%
“…If X is obtained from (4), thermal fields F can be reconstructed using (2). If S ≥ K and rank (D S ) = K, X has a unique solution, denoted as X , substituting X into (2) provides the reconstruction of F, denoted as F . That is, the thermal fields F can be reconstructed from a limited number of temperature sensors.…”
Section: Principlementioning
confidence: 99%
“…Accordingly, acute thermal problems need to be seriously considered because there are increasingly more devices integrated within the limited areas of very-large-scale integrated chips, such as multicore processors, which lead to a large increase in chip power density and an obvious rise in operating temperature. The overheating of the chip reduces the integrated circuit performance, shortens the lifetime of the chip, and even leads to chip failure [1,2]. To solve the thermal problem, the dynamic thermal management (DTM) technique has been proposed [3][4][5][6].…”
Section: Introductionmentioning
confidence: 99%