2022
DOI: 10.1364/ol.457309
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Hybrid nanophotonic–microfluidic sensor for highly sensitive liquid and gas analyses

Abstract: Today, a lab-on-a-chip is one of the most promising ways to create sensor devices for gas and liquid analysis for environmental monitoring, early diagnosis, and treatment effectiveness assessment. On the one hand, this requires a large number of measurements and, on the other hand, involves minimum consumption of the test analytes. Combination of highly sensitive photonic integrated circuits (PICs) with microfluidic channels (MFCs) is necessary to solve this problem. In this work, PICs based on a silicon nitri… Show more

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Cited by 9 publications
(10 citation statements)
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“…Among them MZIs and MRRs are the most common sensors for biosensing applications due to the plain fabrication process and well-explored data processing algorithms . Also, the combination of PICs (MZIs and MRRs) with MFCs for comparison of their detection limit (DL) and sensitivity (S) on a Si 3 N 4 platform with fixed microfludic parameters has been already presented for liquid and gas samples . The main advantages are the high S and ultralow DL, ultralow necessary volume for one PIC, and possibility for determining the concentrations of unknown two-component solutions or gas mixtures.…”
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confidence: 99%
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“…Among them MZIs and MRRs are the most common sensors for biosensing applications due to the plain fabrication process and well-explored data processing algorithms . Also, the combination of PICs (MZIs and MRRs) with MFCs for comparison of their detection limit (DL) and sensitivity (S) on a Si 3 N 4 platform with fixed microfludic parameters has been already presented for liquid and gas samples . The main advantages are the high S and ultralow DL, ultralow necessary volume for one PIC, and possibility for determining the concentrations of unknown two-component solutions or gas mixtures.…”
mentioning
confidence: 99%
“…Chip topology included a Si wafer layer with a thickness of about 540 μm, then a silicon oxide layer as a buffer formed on it (SiO 2 ) with a thickness of 2.6 μm, and an optical layer of Si 3 N 4 formed on top by low-pressure chemical vapor deposition (LPCVD) with a thickness of 450 nm. The PICs fabrication process was previously reported …”
mentioning
confidence: 99%
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