Hybrid optical switch using passive polymer waveguides and semiconductor optical amplifiers

Fan, R.S.; Hooker, R. Brian

doi:10.1109/50.838129

Cited by 9 publications

(4 citation statements)

References 26 publications

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“…[13][14][15][16][17][18][19][20][21] Also, significant work has been presented on hybrid integration, such as a hybrid switch with an amplifier and the integration of photo detectors. [21][22][23] It has been proven that polymer is a promising material for functional devices and that it has the potential to reduce the production costs of these devices significantly.…”

Section: Introductionmentioning

confidence: 99%

Hybrid-integrated optical isolators and circulators

Fujita¹,

Gerhardt²,

Eldada³

2002

SPIE Proceedings

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Magneto-optics is an area that is uniquely enabling for the production of non-reciprocal components such as optical isolators and circulators. The concepts behind the non-reciprocity include nonreciprocal polarization rotation (Faraday rotation) and nonreciprocal phase shift. A magneto-optic material that is magnetized in the direction of propagation of light acts as a Faraday rotator. An asymmetric magneto-optic waveguide that is magnetized perpendicular to the propagation direction acts as a nonreciprocal phase shifter. Both effects can be utilized to realize nonreciprocal devices. Today, commercial isolators and circulators are strictly bulk components, and as such they constitute the only type of optical component that is not available in integrated form. However, the technology for integrated nonreciprocal devices has been maturing and is expected to have a considerable impact in the communication industry by enabling the integration of complete optical subsystems. We report on the development of integrated optical isolators and circulators that consist of polymer-based planar interferometers with inserted thin films of cerium-substituted Yttrium Iron Garnet (Ce-YIG) for efficient Faraday rotation, and thin films of LiNbO 3 for wave-retarders that enable polarizationindependent operation.

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Section: Introductionmentioning

confidence: 99%

Hybrid-integrated optical isolators and circulators

Fujita¹,

Gerhardt²,

Eldada³

2002

SPIE Proceedings

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“…Also, directional coupler and Mach-Zehnder switches, being able to have unwanted crosstalk between neighboring channels, have difficulties in obtaining high extinction ratios. Therefore, optical amplifier switches using semiconductor optical amplifier (SOA) chips have been very attractive since they have large extinction ratios and also have the ability to amplify the signal to compensate for the optical losses [1]. There are many reports on optical switches using SOA chips flip-chip bonded on PLC platforms, which are focused on integration fabrication, module performance, and system demonstration [2]- [4].…”

Section: Introductionmentioning

confidence: 99%

Multichip Integration on a PLC Platform for 16$\,\times\,$16 Optical Switch Module Using Passive Alignment Technique

Rho

Lim

2007

IEEE Trans. Adv. Packag.

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We have integrated eight sets of four-channel semiconductor optical amplifier (SOA) array chips on a silica-based planar lightwave circuit (PLC) platform for 16 16 optical switch module by flip-chip bonding technique. To accurately bond eight sets of the arrayed SOA chips on a PLC platform, two methods of two-step assembly and one-step assembly were tried. Among the results of two assembly methods, one-step assembly was estimated to be desirable in respect of the horizontal and vertical bonding accuracy. The bonding accuracy was measured to be within 0.5 m. Also, we demonstrated 16 16 optical switch module.Index Terms-Flip-chip bonding, optical switch, planar lightwave circuit (PLC), semiconductor optical amplifier (SOA).

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“…The focuses of these reports were on integration fabrication, module performance, and system demonstration. [1][2][3][4][5] In order to produce large quantities of SOA gate switch modules at low cost, planar lightwave circuit (PLC) platforms were extensively studied. These efforts have been made to increase the number of channels or chips and reduce the platform size.…”

Section: Introductionmentioning

confidence: 99%

Multi-chip Integration on a PLC Platform for 16X16 Port Optical Switch Using Passive Alignment Technique

Lim

Kim

et al.

56th Electronic Components and Technology Conference 2006

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We propose simple assembly techniques capable of performing high density multi-chip integration on a PLC platform with eutectic AuSn solder bumps, for 16x16 port SOA gate switch composed 2x2 optical switch SOA array chips using passive alignment technique. Conventional methods have used chip-by-chip bonding method. These methods are found it is difficult to obtain high bonding strength because the solder interconnections remelt during repeated bonding steps. To overcome this problem, we investigated the single re-flow processes and optimized the bonding condition for non re-flow process on minimum AuSn solder bump spreading. Also, die shear tests were conducted to evaluate mechanical reliability between the solder bump and the chip pads.

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Hybrid optical switch using passive polymer waveguides and semiconductor optical amplifiers

Cited by 9 publications

References 26 publications

Hybrid-integrated optical isolators and circulators

Hybrid-integrated optical isolators and circulators

Multichip Integration on a PLC Platform for 16$\,\times\,$16 Optical Switch Module Using Passive Alignment Technique

Multi-chip Integration on a PLC Platform for 16X16 Port Optical Switch Using Passive Alignment Technique

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