2021
DOI: 10.1016/j.compositesa.2021.106574
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Hybrid shell of MXene and reduced graphene oxide assembled on PMMA bead core towards tunable thermoconductive and EMI shielding nanocomposites

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Cited by 74 publications
(18 citation statements)
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“…The T HRI of the untreated and modified silk is 113°C and 113.75°C, respectively, while the T 50 (temperature at weight loss of 50 wt%) is 398.42 and 489.13°C, respectively. Additionally, the residual amount of the modified silk with 40.62% is greater than that of the untreated silk with 33.53% at 600°C, it can be contributed to the amount of undecomposed Fe 3 O 4 particles 74,75 . These results indicated the modification treatment did not weaken the thermal stability of silk fibers.…”
Section: Resultsmentioning
confidence: 83%
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“…The T HRI of the untreated and modified silk is 113°C and 113.75°C, respectively, while the T 50 (temperature at weight loss of 50 wt%) is 398.42 and 489.13°C, respectively. Additionally, the residual amount of the modified silk with 40.62% is greater than that of the untreated silk with 33.53% at 600°C, it can be contributed to the amount of undecomposed Fe 3 O 4 particles 74,75 . These results indicated the modification treatment did not weaken the thermal stability of silk fibers.…”
Section: Resultsmentioning
confidence: 83%
“…The temperature at maximum weight loss for the untreated and modified silk fabrics is 333.5°C and 328.7°C, respectively 72 . Further, the heat resistance index (HRI) for the untreated and modified silk fabric was calculated according to T 5 and T 30 (the temperature at weight loss of 5 wt% and 30 wt%, respectively) as followed by 73,74 : THRIgoodbreak=0.49goodbreak×[]T5goodbreak+0.6goodbreak×()T30goodbreak−T5 …”
Section: Resultsmentioning
confidence: 99%
“…In Figure a and b, the thermal conductivity and EMI SE of M- o -GWF/thermoplastic composites prepared using the same process are in the range of 7.40–9.26 W m –1 K –1 and 55.7–62.5 dB, respectively, at a filler content of 2.91–3.55 wt % (also see Figures S20 and S21 and Tables S9 and S10). Figure c and Table S11 indicate that our samples with different thermoplastic matrices can also achieve superior EMI SE and thermal conductivity performance simultaneously, compared to existing thermoplastic composites. ,, In Figure d and e, a comparison test was done to present the practical effect of EMI protection of the device with M- o -GWF/PE composite plates. A light-emitting diode (LED) display panel coupled with a Bluetooth receiver was sealed in a shielding case with a cutout in an area of 5 mm × 10 mm.…”
Section: Results and Discussionmentioning
confidence: 98%
“…Vu et al 173 prepared a hybrid shell of MXene and rGO assembled on a PMMA bead as a core (Fig. 14a).…”
Section: Fiber Core-shell Structuresmentioning
confidence: 99%