2021
DOI: 10.1021/acsphotonics.1c01053
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Hybrid Silicon Microlasers with Gain Patches of Unlimited Designs

Abstract: Integrating the smallest possible lasers into silicon photonics has long been an objective of photonic integrated circuits. However, efficient combining of small lasers to silicon photonics has been a major challenge because of the need to overcome meticulous laser designs and flawless alignments. In this paper, we propose and demonstrate a new concept of hybrid silicon microlasers that are automatically integrated into silicon photonics by simply placing III–V gain patches with no restrictions of design and a… Show more

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Cited by 3 publications
(3 citation statements)
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“…Although this process worked well with the most wire-typed nanostructures, it was sometimes limited to picking up the structures that were shorter than ∼7 μm and/or wider than ∼500 nm. For those structures, we have developed a unique two-step pick-up and transfer process (Figure S2) that takes full advantage of the optical and mechanical properties of PDMS microtips, for example, high optical transparency in the visible wavelengths, good mechanical flexibility, and controllable adhesive force. We believe that the above-described two-step transfer technique is simple and readily applicable to a variety of micro/nanostructures and thus useful for many applications that require highly accurate hybrid and/or heterogeneous on-chip integration.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…Although this process worked well with the most wire-typed nanostructures, it was sometimes limited to picking up the structures that were shorter than ∼7 μm and/or wider than ∼500 nm. For those structures, we have developed a unique two-step pick-up and transfer process (Figure S2) that takes full advantage of the optical and mechanical properties of PDMS microtips, for example, high optical transparency in the visible wavelengths, good mechanical flexibility, and controllable adhesive force. We believe that the above-described two-step transfer technique is simple and readily applicable to a variety of micro/nanostructures and thus useful for many applications that require highly accurate hybrid and/or heterogeneous on-chip integration.…”
Section: Resultsmentioning
confidence: 99%
“…Specifically, we fabricated an all-graphene-contact device by introducing mechanically flexible and optically transparent graphene contacts at the top and bottom surfaces of a semiconductor NW. The vertically p–i–n-doped top-down-fabricated NWs are precisely align-transferred on a target site in a chip by using a microstructured polymer-assisted transfer-printing technique. Electroluminescence (EL) spectroscopy was carried out to demonstrate the successful operation of the device and characterize its optical properties. We also coupled an electrically pumped NW source to a strip-type photonic waveguide (SPWG) to demonstrate the on-demand integration and successfully showed light coupling and waveguiding.…”
Section: Introductionmentioning
confidence: 99%
“…Thus, to use these approaches, one should initially bond a large volume of III-V dies in an extended area of the coupling region, which inevitably sacrifices the massive III-V materials, high integration density, and compactness [7,10,12]. In this regard, a recently emerging integration technique of micro transfer printing using a microstructured adhesive polymer stamp has drawn considerable attention, demonstrating its ability to mechanically manipulate micro-and nano-scale materials and structures in a highly precise and accurate manner [18][19][20][21][30][31][32][33]. For example, an edge-emitting III-V gain media was transfer-printed using a polymer microtip [17,18].…”
Section: Introductionmentioning
confidence: 99%