Hydrogen bonding-based strongly adhesive coacervate hydrogels synthesized using poly(<i>N</i>-vinylpyrrolidone) and tannic acid

Nam, Hyeon Gyun; Nam, Myeong Gyun; Yoo, Pil J.; Kim, Ji‐Heung

doi:10.1039/c8sm02144a

Cited by 147 publications

(102 citation statements)

References 41 publications

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“…In summary, due to the large number of phenol groups with both an acidic and hydrogen‐bonding donor characteristics, TA can interact effectively and strongly with the t ‐amide groups of PEOX to form either a coacervate or complex gel via multiple interactions with hydrogen bonding in aqueous solutions. In other reports, the hydrogen bonding complex formation between TA and poly( N ‐vinylpyrrolidone) or other water‐soluble polymers has been investigated previously …”

Section: Resultsmentioning

confidence: 99%

Supramolecular adhesive gels based on biocompatible poly(2‐ethyl‐2‐oxazoline) and tannic acid via hydrogen bonding complexation

Dang

Moon

Jeon

et al. 2019

J of Applied Polymer Sci

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A facile fabrication of strongly adhesive hydrogel based on high‐molecular‐weight poly(2‐ethyl‐2‐oxazoline) (PEOX) and tannic acid (TA) has been demonstrated. PEOX and TA form instantaneous complex gel via strong hydrogen bonding interaction by simple mixing in an aqueous system. The characteristics of the PEOX–TA complex gels was investigated by using Fourier transform infrared spectroscopy, thermogravimetric analysis, differential scanning calorimetry, and scanning electron microscopy to reveal their network structure, composition, and thermal properties. The prepared wet complex gel system demonstrated excellent adhesive performance on different substrates with comparable results to pure PEOX polymer. It was considered that many factors affect the adhesive performance of the PEOX–TA gel such as the TA content, the molecular weight of PEOX, and water content. This adhesive gel system has potential for use in various fields including biomedical application as a novel and low‐cost adhesive or sealant. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2020, 137, 48285.

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Section: Resultsmentioning

confidence: 99%

Supramolecular adhesive gels based on biocompatible poly(2‐ethyl‐2‐oxazoline) and tannic acid via hydrogen bonding complexation

Dang

Moon

Jeon

et al. 2019

J of Applied Polymer Sci

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“…As observed in these results, the majority of the samples exhibited sufficient bonded interfacial strength to endure a series of optoelectronic device fabrication processes and user operations. The hydrogen bonds stemming from PAM presumably cause the adhesion to the semiconductor surfaces [20,21]. More specifically, hydrogen bonds may form between the -NH 2 groups of PAM and the Si surface terminated by -OH groups, owing to the water contained in PAM [20].…”

Section: Experimental Methodsmentioning

confidence: 99%

“…The hydrogen bonds stemming from PAM presumably cause the adhesion to the semiconductor surfaces [20,21]. More specifically, hydrogen bonds may form between the -NH 2 groups of PAM and the Si surface terminated by -OH groups, owing to the water contained in PAM [20]. In addition, the PAM matrix holds the WCM particles, suppressing their sedimentation.…”

Section: Experimental Methodsmentioning

confidence: 99%

Wavelength-Conversion-Material-Mediated Semiconductor Wafer Bonding for Smart Optoelectronic Interconnects

Kishibe¹,

Hirata²,

Inoue³

et al. 2019

Nanomaterials

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A new concept of semiconductor wafer bonding, mediated by optical wavelength conversion materials, is proposed and demonstrated. The fabrication scheme provides simultaneous bond formation and interfacial function generation, leading to efficient device production. Wavelength-converting functionalized semiconductor interfacial engineering is realized by utilizing an adhesive viscous organic matrix with embedded fluorescent particles. The bonding is carried out in ambient air at room temperature and therefore provides a cost advantage with regard to device manufacturing. Distinct wavelength conversion, from ultraviolet into visible, and high mechanical stabilities and electrical conductivities in the bonded interfaces are verified, demonstrating their versatility for practical applications. This bonding and interfacial scheme can improve the performance and structural flexibility of optoelectronic devices, such as solar cells, by allowing the spectral light incidence suitable for each photovoltaic material, and photonic integrated circuits, by delivering the respective preferred frequencies to the optical amplifier, modulator, waveguide, and detector materials.

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“…The hydrogen bonds from PAM may cause the adhesion to semiconductor surfaces. 35,36 More specifically, hydrogen bonds are presumably formed between the ÀNH 2 groups of PAM and the Si surface terminated by ÀOH groups due to the water contained in PAM. 35 The PAM film had an approximate thickness of 5 lm, larger than typical diameters of particles in a regular, noncleanroom environment (< 3 lm).…”

mentioning

confidence: 99%

“…35,36 More specifically, hydrogen bonds are presumably formed between the ÀNH 2 groups of PAM and the Si surface terminated by ÀOH groups due to the water contained in PAM. 35 The PAM film had an approximate thickness of 5 lm, larger than typical diameters of particles in a regular, noncleanroom environment (< 3 lm). Therefore, even in the presence of such particles on wafers, hydrogel films change their own morphology to enclose the particles and result in particulate tolerances.…”

mentioning

confidence: 99%

Hydrogel-mediated semiconductor wafer bonding

Kishibe

Tanabe

2019

Applied Physics Letters

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The concept of hydrogel-mediated semiconductor wafer bonding was proposed and demonstrated in this work. The unique property of hydrogels was utilized to simultaneously realize high mechanical stability, electrical conductivity, and optical transparency in semiconductor interfaces. The high applicability of this method for rough surfaces to be bonded was also demonstrated, owing to the soft, deformable interfacial contact agent to be solidified in the bonding process. Furthermore, the bonding experiments were carried out in ambient air at room temperature, which, therefore, provides cost and throughput advantages in device production. In addition, the developed bonding technique was used for demonstrating the fabrication and operation of solar cell devices, with current paths across the bonded interfaces, which verified the method's practical applicability. Our semiconductor bonding and interfacial engineering scheme are expected to open up a pathway for simple, handy, and low-cost, but flexible and high-performance optoelectronic material integration.

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Hydrogen bonding-based strongly adhesive coacervate hydrogels synthesized using poly(N-vinylpyrrolidone) and tannic acid

Abstract: A supramolecular coacervate hydrogel was synthesized by simply mixing poly(N-vinylpyrrolidone) (PVP) and tannic acid (TA). Resulting super adhesive properties showed adhesion strength of 3.71 MPa on a glass substrate.

Cited by 147 publications

References 41 publications

Supramolecular adhesive gels based on biocompatible poly(2‐ethyl‐2‐oxazoline) and tannic acid via hydrogen bonding complexation

Supramolecular adhesive gels based on biocompatible poly(2‐ethyl‐2‐oxazoline) and tannic acid via hydrogen bonding complexation

Wavelength-Conversion-Material-Mediated Semiconductor Wafer Bonding for Smart Optoelectronic Interconnects

Hydrogel-mediated semiconductor wafer bonding

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