2017
DOI: 10.1016/j.actamat.2017.07.017
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Hydrogen enhances the radiation resistance of amorphous silicon oxycarbides

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Cited by 12 publications
(8 citation statements)
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“…The breaking and formation of the Si–O and Si–C bonds are mainly observed. The slight decrease in the number of Si–O bonds and increase in the Si–C bonds agree well with the literature . The breaking and formation of the Si–Si and C–C bonds are also observed, and their bond numbers are almost unchanged before and after ion irradiation.…”
Section: Resultssupporting
confidence: 91%
“…The breaking and formation of the Si–O and Si–C bonds are mainly observed. The slight decrease in the number of Si–O bonds and increase in the Si–C bonds agree well with the literature . The breaking and formation of the Si–Si and C–C bonds are also observed, and their bond numbers are almost unchanged before and after ion irradiation.…”
Section: Resultssupporting
confidence: 91%
“…Previous investigations have shown that reliable atomistic models of SiOC must contain approximately 1500 atoms: a relatively large number for DFT calculations 12 , 33 . Thus, to optimize use of computational resources, we do not perform our calculations directly on SiOC models.…”
Section: Resultsmentioning
confidence: 99%
“…However, in both cases, their effect is small, indicating that the resistance of SiOC to He-induced damage does not depend crucially on composition. This finding is important for the continued development of radiation-resistant SiOC materials, as it suggests that their composition may be tuned to optimize other properties—such as thermal stability 33 or resistance to displacement damage 12 —without affecting their immunity to He. However, if the C concentration increases so much that the CRN structure begins to break down, we expect that the behavior of He in SiOC may undergo a qualitative change.…”
Section: Discussionmentioning
confidence: 99%
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“…Further applications are reactions occurring during the deposition of low-κ dielectric SiCO/H materials, as well as thermal treatment of these materials (post or concurrent synthesis) in reactive atmospheres such as H 2 O, CO 2 , or H 2 . Future direction involves thermodynamic and kinetic stability of dielectric films, thermal conductivity, and the effects of radiation damage , or ion implantation . Obviously, force field development is an ongoing process with room for improvement and progress.…”
Section: Discussionmentioning
confidence: 99%