2020
DOI: 10.1109/ted.2020.3017145
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Hydrogen Impacts of PEALD InGaZnO TFTs Using SiOx Gate Insulators Deposited by PECVD and PEALD

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Cited by 40 publications
(25 citation statements)
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“…So far, many articles on sputtering-deposited AZO films and correspondingly application examples have been reported [ 11 , 12 , 13 , 14 ]. However, the sputtering process suffers from the distinct disadvantages of high-vacuum background pressure, surface damage of pre-deposited films, worse repeatability, and film composition limitations [ 15 , 16 ]. Therefore, it is important to develop novel processes for depositing transparent conductive AZO films.…”
Section: Introductionmentioning
confidence: 99%
“…So far, many articles on sputtering-deposited AZO films and correspondingly application examples have been reported [ 11 , 12 , 13 , 14 ]. However, the sputtering process suffers from the distinct disadvantages of high-vacuum background pressure, surface damage of pre-deposited films, worse repeatability, and film composition limitations [ 15 , 16 ]. Therefore, it is important to develop novel processes for depositing transparent conductive AZO films.…”
Section: Introductionmentioning
confidence: 99%
“…Positive‐bias temperature stress (PBTS) instabilities of both devices were examined under a gate bias stress of +30 V and a chuck temperature of 60°C (Figure 10D). Devices with plasma‐enhanced CVD‐derived SiO 2 suffered from an abnormal V TH shift of −1.25 V, which can be attributed to the migration of hydrogen impurities in SiO 2 film as shown by the results of Fourier‐transform infrared and elastic recoil detection analysis in Figure 10E,F, respectively 79,80 . In contrast, a device with a plasma‐enhanced ALD‐derived SiO 2 dielectric exhibited a normal V TH shift of +2.87 V under identical PBTS conditions.…”
Section: Ald‐derived N‐channel Oxide Tftsmentioning
confidence: 95%
“…Industrial standard SiO 2 film for IGZO TFTs is deposited by plasma‐enhanced chemical vapor deposition (CVD) at temperatures above 300°C because of the excellent leakage characteristics produced by a wide E g of 8 to 9 eV and its conformality and patterning capability. To fabricate oxide TFTs on non‐planar or 3D scheme structure, SiO 2 gate dielectric films by ALD have been investigated 77–79 . Although CVD offers acceptable step coverage on a planar substrate, its conformality on nano‐trench or step structures is limited.…”
Section: Ald‐derived N‐channel Oxide Tftsmentioning
confidence: 99%
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“…Moreover, PECVD is one of the main processes used in the nanofabrication of electron devices in order to deposit high quality thin film semiconductors (Jeong et al, 2020). Generally, in nanofabrictation, PECVD of a thin film immediately follows the doping of silicon compound film pre-grown on Si wafer with either Arsenic, phosphorous, or boron via Ion Implantation which aims to tune the conductivity, relative to a particular technology application of the semiconductor industry (Skorupa et al, 1987;Yokota et al, 1994).…”
Section: Pecvd Deposition Technique Backgroundmentioning
confidence: 99%