“…In the 3d series, the consequences of hydrogenation by remote plasma, wet chemical etching, or H implantation have been reported for Ti, 4,5 V, 4,6,7 Cr, 4,6 Fe, [8][9][10][11][12][13][14] Co, 15 Ni, 16 and Cu. [17][18][19][20] Following hydrogenation, the electrical levels of the TM impurity have been monitored by deep-level transient spectroscopy ͑DLTS͒, Laplace DLTS, or thermally stimulated capacitance ͑TSCAP͒.…”