2022
DOI: 10.3390/mi13040547
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Hydrogen Storage Performance of γ-Graphdiyne Doped Li Based on First Principles for Micro/Nano

Abstract: The rapid development of micro/nano systems promotes the progress of micro energy storage devices. As one of the most significant representatives of micro energy storage devices, micro hydrogen fuel cells were initially studied by many laboratories and companies. However, hydrogen storage problems have restricted its further commercialization. The γ-graphdiyne (γ-GDY) has broad application prospects in the fields of energy storage and gas adsorption due to its unique structure with rigid nano-network and numer… Show more

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Cited by 8 publications
(3 citation statements)
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“…However, the intrinsic defects and poor hydrogen binding strength of GDY may limit its hydrogen storage capacity. Tian et al [70] have comprehensively investigated the adsorption feature of hydrogen on pure GDY and discovered that hydrogen molecules prefer to adsorb at the center of the triangle hole with adsorption energy of À 0.0786 eV. The low bonding strength between hydrogen and GDY indicates that hydrogen is readily desorbed from the GDY surface.…”
Section: Applications Of Gdy In Solid Hydrogen Storagementioning
confidence: 99%
“…However, the intrinsic defects and poor hydrogen binding strength of GDY may limit its hydrogen storage capacity. Tian et al [70] have comprehensively investigated the adsorption feature of hydrogen on pure GDY and discovered that hydrogen molecules prefer to adsorb at the center of the triangle hole with adsorption energy of À 0.0786 eV. The low bonding strength between hydrogen and GDY indicates that hydrogen is readily desorbed from the GDY surface.…”
Section: Applications Of Gdy In Solid Hydrogen Storagementioning
confidence: 99%
“…The main methods of micro bump preparation include electrodeposition, screen printing, solder injection and evaporation [ 15 , 16 ]. The electrodeposition method has been widely used in practical production because of its simple process, low cost, easy mass production, and high adaptability [ 17 , 18 ].…”
Section: Introductionmentioning
confidence: 99%
“…At the same time, with the slowdown of Moore’s Law, to meet the requirement of doubling the computing power every two years, it is necessary to add additional chip size, which increases the manufacturing cost and also reduces the chip yield. Therefore, it is becoming less and less cost-effective to improve chip performance and reduce power consumption by upgrading the IC process [ 3 ]. To efficiently process such large amounts of data and break up the “storage wall”, it is necessary to develop PIM technology [ 4 , 5 ].…”
Section: Introductionmentioning
confidence: 99%