1985
DOI: 10.1109/tmag.1985.1063748
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Hydrogenated amorphous silicon barriers for niobium-niobium Josephson junctions

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1985
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Cited by 12 publications
(4 citation statements)
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“…Among devices with direct conduction, relatively high values of V c required for digital applications have been demonstrated by Nb-based junctions with amorphous Si barriers doped by various impurities creating deep levels near the middle of the band gap, like Nb, W, etc. ; see [128] and references therein, [129-[131], and many older works, e.g., [132]- [134]. From the author's point of view, their only advantage is that, at large levels of doping (~ 10%), selfshunting and nonhysteretic behavior is obtained.…”
Section: Vlsi Technology Developmentmentioning
confidence: 99%
“…Among devices with direct conduction, relatively high values of V c required for digital applications have been demonstrated by Nb-based junctions with amorphous Si barriers doped by various impurities creating deep levels near the middle of the band gap, like Nb, W, etc. ; see [128] and references therein, [129-[131], and many older works, e.g., [132]- [134]. From the author's point of view, their only advantage is that, at large levels of doping (~ 10%), selfshunting and nonhysteretic behavior is obtained.…”
Section: Vlsi Technology Developmentmentioning
confidence: 99%
“…The Appelbaum-Anderson model has been successfully applied to Josephson tunnel junctions formed by low-temperature superconductors employing hydrogenated amorphous silicon barriers [29]. Initially, it also was used to explain the experimentally observed zero bias conductance peak in tunnel junctions employing HTS electrodes [12,30,31,32,33,34].…”
Section: Appelbaum-anderson Modelmentioning
confidence: 99%
“…The present paper is devoted to the detailed investigation of the effects of the PECVD process on the superconducting, normal-state and structural properties of a 20 nm thick Nb film which was utilized as a substrate for the a-Si:H growth. Nitridation of Nb films [9] and deposition of a sputtered thin amorphous unhydrogenated Si layer on the Nb films [10] (in both cases made in situ after Nb film deposition) were investigated as methods for protecting the Nb films during PECVD. As regards the latter protective method, in [10] a thin (0.8-0.9 nm) amorphous unhydrogenated Si layer has already been utilized for protection of the Nb base electrode from hydrogen diffusion during the deposition of a thin (4 nm) a-Si:H layer as a tunnel barrier made by RF sputtering of a Si target in an Ar/H 2 mixture atmosphere at room temperature.…”
Section: Introductionmentioning
confidence: 99%
“…Nitridation of Nb films [9] and deposition of a sputtered thin amorphous unhydrogenated Si layer on the Nb films [10] (in both cases made in situ after Nb film deposition) were investigated as methods for protecting the Nb films during PECVD. As regards the latter protective method, in [10] a thin (0.8-0.9 nm) amorphous unhydrogenated Si layer has already been utilized for protection of the Nb base electrode from hydrogen diffusion during the deposition of a thin (4 nm) a-Si:H layer as a tunnel barrier made by RF sputtering of a Si target in an Ar/H 2 mixture atmosphere at room temperature. In contrast, in the present work the protective capability of the thin (3 nm) amorphous unhydrogenated Si layer has been investigated in detail in the case of thick (∼250 nm) a-Si:H deposited on an Nb film by a PECVD process at high temperature (in our experiment, 250 • C).…”
Section: Introductionmentioning
confidence: 99%