The (5 × 5) Moiré pattern
resulting from
coadsorption
of Cu atoms and chloride ions on the Au(111) electrode is one of the
most classical structures for underpotential deposition (UPD) in electrochemical
surface science. Although two models have been proposed to describe
the pattern, the details of the structure remain ambiguous and controversial,
leading to a question that remains to be answered. In this work, we
investigate the UPD behaviors of Cu on the Au(111) electrode in a
chloride-based deep eutectic solvent ethaline by in situ scanning
tunneling microscopy (STM). Benefiting from the properties of the
ultraconcentrated electrolyte, we directly image not only Cu but also
Cl adlayers by finely tuning tunneling conditions. The structure is
unambiguously determined for both Cu and Cl adlayers, where an incommensurate
Cu layer is adsorbed on the Au(111) surface with a Cu coverage of
0.64, while the Cl coverage is 0.32 (only half of the expected value);
i.e., the atomic arrangement of the observed (5 × 5) Moiré
pattern in ethaline matches neither of the models proposed in the
literature. Meanwhile, STM results confirm the origin of the cathodic
peak in the cyclic voltammogram, which indicates that the underpotential
shift of Cu UPD in ethaline indeed increases by ca. 0.40 V compared
to its counterpart in a sulfuric acid solution, resulting in a significant
deviation from the linear relation between the underpotential shift
and the difference in work functions proposed in the literature. The
unconventional electrochemical behaviors of Cu UPD reveal the specialty
of both the bulk and the interface in the chloride-based deep eutectic
solvent.