2018
DOI: 10.1149/08610.0003ecst
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(Invited) Computer Simulation of Intrinsic Point Defect Distribution Valid for All Pulling Conditions in Large-Diameter Czochralski Si Crystal Growth

Abstract: To explain and engineer intrinsic point defect behavior in large-diameter single crystal Si grown using the Czochralski (CZ) method, a unified model valid for all pulling processes, crystal resistivities, and electrically inactive impurity concentrations that couples the effects of thermal stress, dopants, and interstitial oxygen (Oi) atoms is needed. We determined the thermal equilibrium concentration of intrinsic point defects (vacancy V and self-interstitial Si I) in CZ-Si crystal as functions of thermal st… Show more

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Cited by 3 publications
(2 citation statements)
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“…x cri changes depending on the concentration of impurity atoms, such as dopants and oxygen incorporated into the crystal, [5][6][7][8][9][10][11][12][13][14] and the shape of the solid-liquid interface during crystal growth. 15,16) Furthermore, x cri is affected by thermal stress in the crystal during crystal growth.…”
Section: Introductionmentioning
confidence: 99%
“…x cri changes depending on the concentration of impurity atoms, such as dopants and oxygen incorporated into the crystal, [5][6][7][8][9][10][11][12][13][14] and the shape of the solid-liquid interface during crystal growth. 15,16) Furthermore, x cri is affected by thermal stress in the crystal during crystal growth.…”
Section: Introductionmentioning
confidence: 99%
“…A wide range of oxygen concentrations can be investigated as changes in solid-liquid interface shapes and thermal stress can be considered to determine α. Although there are cases wherein PDSim was used to investigate the impact of α on the point defect behavior and tendency (x cri ), [21][22][23] there has been no investigation on determining α by using PDSim.…”
Section: Introductionmentioning
confidence: 99%