<i>S</i>-Parameter De-Embedding Error Estimation Based on the Statistical Circuit Models of Fixtures

Liu, Yuanzhuo; Yong, Shaohui; Gao, Han; Hinaga, Scott; Padilla, Darja; Yanagawa, Douglas; Drewniak, James L.

doi:10.1109/temc.2020.2992553

Cited by 18 publications

(8 citation statements)

References 21 publications

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“…The left and right fixtures used to connect each of the N = 20 ports of the connector to the VNA have been developed and characterized using time and frequency domain measurement techniques, as reported in references 4,26. They consist of a midsection of 3‐inch long‐coupled strip lines; on the port sides, each fixture includes a stripline to coaxial transition and a 2.4 mm coaxial connector toward the measurement system.…”

Section: Numerical Validationmentioning

confidence: 99%

“…In the process of experimentally characterizing the performances and specifications of electronic devices in the world of signal integrity (SI) or radio frequency (RF) applications, the de-embedding process [1][2][3] is a post-measurement technique aimed at revealing information about the device under test (DUT) by removing the impact introduced by the fixtures (ranging from simple connectors to more complex assemblies) used to connect the DUT to the measurement system. 4 In reference 5, the most recent de-embedding methods are reviewed and investigated using both 3D simulation and vector network analyzer (VNA) measurements to accurately evaluate their residual error. Then, some potential sources of error are hypothesized and overcome by proposing solutions based on a de-embedding plane that can ensure a TEM (or quasi-TEM) mode propagation.…”

Section: Introductionmentioning

confidence: 99%

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Generalized analytical formulation for de‐embedding of multiport devices based on known fixtures

Scafati

Paulis

Olivieri

et al. 2022

Int J RF Mic Comp-Aid Eng

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The de-embedding is a technique used in radio frequency and signal integrity measurements to extract the scattering (S)-parameters of the device under test (DUT) from the measured data of a global assembly and based on known S-parameters of the left and right test fixtures; thus, it removes the impact of the text fixtures used for the connection of the DUT to the instrumentation. Once the S-parameters are measured, the de-embedding is performed by a multistep approach involving the bidirectional transformation of the S-parameters into the corresponding transfer scattering (T)-parameters. The latter approach is well established for two-and four-port networks and has been recently expanded to the multiport case. This work proposes an alternative analytical formulation to de-embed a multiport device, knowing in advance only the S-parameters of the global multiport assembly and those of the test fixtures. The proposed method does not involve the S-to-T conversion and it requires only the algebraic manipulation of the S-parameter matrix elements; its practical implementation is very well fitted especially for multiport cases, and it is very fast in calculating the de-embedded DUT S-parameters for large port numbers. The results of the proposed formulation, applied to the case of a multipin high-speed connector, are compared with those obtained by measurement and simulations.Their accuracy is shown and discussed to demonstrate the validity of the proposed approach.

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Section: Numerical Validationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Generalized analytical formulation for de‐embedding of multiport devices based on known fixtures

Scafati

Paulis

Olivieri

et al. 2022

Int J RF Mic Comp-Aid Eng

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“…7, we saw that (13) may fit the ZTDR(t) quite well. This gives us the idea that, given a rising ZTDR(t), we can first fit it with (13) to obtain estimates for the parameters Z∞ and a. Then, a causal model for ZLINE can be constructed by (25) or (26) (Appendix-D).…”

Section: B Estimation Of Zline For High Conductor-loss Linesmentioning

confidence: 99%

“…Substituting ( 16) into (9), and again assuming G = 0, we arrive at the following model for characteristic impedance: Fitting by (13) Connector, microstrip, and via…”

Section: B Estimation Of Zline For High Conductor-loss Linesmentioning

confidence: 99%

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The Reference Impedance in 2x-thru Calibration, and its Estimation for High Conductor-loss Transmission Lines

Chou¹

2022

Preprint

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<p>The 2x-thru calibration has emerged as an attractive alternative to the classical TRL for S parameter measurement of printed circuit board and packaging devices, due to its simplicity that only one THRU standard suffices to fully characterize the test fixtures, thus eliminating the LINE measurement in TRL and also overcoming the bandwidth limit. Although various 2x-thru calibration tools are available nowadays, there are still some issues that have not been studied in detail. This paper addresses the following two fundamental questions: (i) what is the reference impedance (Zref) of the S parameters after 2x-thru calibration? (ii) what is the time-domain reflectometry (TDR) response of the THRU for high conductor-loss transmission lines, and how to estimate Zref given such TDR? For problem (i), we rigorously show that the Zref is equal to the characteristic impedance of the center transmission line in the THRU standard, and provide the important interpretation for the S parameters in terms of the traveling-wave and pseudowave concepts. For problem (ii), we show that the TDR impedance is a monotonically increasing function instead of constant, and we propose a new method to estimate the characteristic impedance by fitting the TDR with a causal impedance model. Simulation and measurement examples are provided to validate the proposed theory and techniques. In the last example, we also compare five commercial/open-source 2x-thru calibration tools; the results reveal that with the proposed method of impedance estimation, better accuracy can be achieved. </p>

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Advanced 3D Packaging of 3.2Tbs Optical Engine for Co-packaged Optics (CPO) in Hyperscale Data Center Networks

Prasad,

Muzio,

Ton

et al. 2024

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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S-Parameter De-Embedding Error Estimation Based on the Statistical Circuit Models of Fixtures

Cited by 18 publications

References 21 publications

Generalized analytical formulation for de‐embedding of multiport devices based on known fixtures

Generalized analytical formulation for de‐embedding of multiport devices based on known fixtures

The Reference Impedance in 2x-thru Calibration, and its Estimation for High Conductor-loss Transmission Lines

Advanced 3D Packaging of 3.2Tbs Optical Engine for Co-packaged Optics (CPO) in Hyperscale Data Center Networks

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