<i>W</i>-Band MMIC Chip Assembly Using Laser-Enhanced Direct Print Additive Manufacturing

Abdin, Mohamed M.; Johnson, W. Joel D.; Jing, Wang; Weller, Thomas M.

doi:10.1109/tmtt.2021.3124237

Cited by 3 publications

(2 citation statements)

References 56 publications

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“…With the evolution of additive manufacturing (AM) of microwave packaging in recent years [1], [2], [3], [4], methods of extracting material properties that may be integrated in the AM-oriented design flow have been studied [5], [6], [7], [8], [9], [10], [11]. AM is revolutionizing the field of microwave circuits and antennas by enabling novel geometries and materials that are not practical to achieve by traditional techniques.…”

Section: Introductionmentioning

confidence: 99%

“…Then, a single-layer reduction approach in [19] is applied to model dielectric losses for such a structure. The goal is to incorporate this material characterization technique in rapid system prototyping design flow such as laser-enhanced direct print additive manufacturing (LE-DPAM), highlighted in [1], [3], [4], to quickly extract unknown microwave material properties.…”

Section: Introductionmentioning

confidence: 99%

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A Conformal Mapping-Based Broadband Method to Extract Propagation Properties of Dielectrics Using Coplanar Waveguides With Air Pockets

Rojas-Nastrucci

2023

IEEE J. Microw.

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In recent years, advances in material science for high-frequency electronics have generated novel materials that offer superior performance. Additive manufacturing (AM) has expanded the frontiers of microwave material manufacturing going beyond flat geometries and unique properties such as graded permittivity materials. Accurate electromagnetic (EM) material characterization for AM materials remains challenging given the printing volume constraints for manufacturing processes, as traditional EM property extraction techniques often require electrically large samples. Furthermore, loss extraction techniques typically cannot differentiate dielectric and conductor losses in waveguides. This paper presents a novel conformal mapping-based characterization technique using coplanar waveguides (CPW) with air pockets that allows for dielectric permittivity and dielectric loss extraction. The underlying principle of the techniques is to use a set of CPWs with different air slot depths to extract the loss behavior as a function of the slot depth. A new loss-slot rate metric is introduced to decouple the dielectric and conductor losses in the structure. The theoretical foundation of the technique is used to develop a physical-mathematical model for dielectric property extraction that is verified with simulations and experiments for materials with permittivity in the range 2.33-29, and loss tangents of 0.02-0.055. The average error for the equivalent capacitance of the CPW with air pockets (CPW-AP) between the presented model and simulated or measured data is 2.4% for all the studied cases. The experimental confirmation is performed with traditionally manufactured FR-4 and additively manufactured yttria-stabilized zirconia (YSZ) dielectrics up to 10 GHz.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

A Conformal Mapping-Based Broadband Method to Extract Propagation Properties of Dielectrics Using Coplanar Waveguides With Air Pockets

Rojas-Nastrucci

2023

IEEE J. Microw.

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Conformally printed additively manufactured RF demonstrator for circuit compaction

Luce,

Areias,

Trulli

et al. 2024

Flex. Print. Electron.

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Recently, there has been interest in applying Additive Manufacturing (AM) to RF and Microwave applications, especially in packaging of microelectronic devices. Additive packaging offers advantages of expanded functionality in restricted volume, through miniature, low-SWaP-C sensors, allowing for non-traditional form factors. In this work, design, fabrication, and characterization of a non-planar multi-material MMIC structure is presented to demonstrate significant footprint reduction and circuit compaction. Performance of a non-planar passive RF device and details of planar to non-planar AM connections for characterization of the transitions will be demonstrated. The work will present details of the design and fabrication of the non-planar structure, optimization of the process parameters for the Optomec 5-axis Aerosol Jet Printer for multi-material printing, and the results of the characterization and testing. RF measurements were conducted to demonstrate the functionality of the developed non-planar circuit and compared with simulations which showed good agreement. The results of this work show that fully additive approach is feasible for non-planar circuits, which will allow for footprint reduction, weight reduction, and achievement of novel form factors that are critical for microwave applications.

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The Development of the Technique for Automated Tracing of Printed Circuit Board Interconnections of Electronic Devices

Vagapov

Guzanov

Iakovlev

2023

2023 International Russian Smart Industry Conference (SmartIndustryCon)

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W-Band MMIC Chip Assembly Using Laser-Enhanced Direct Print Additive Manufacturing

Cited by 3 publications

References 56 publications

A Conformal Mapping-Based Broadband Method to Extract Propagation Properties of Dielectrics Using Coplanar Waveguides With Air Pockets

A Conformal Mapping-Based Broadband Method to Extract Propagation Properties of Dielectrics Using Coplanar Waveguides With Air Pockets

Conformally printed additively manufactured RF demonstrator for circuit compaction

The Development of the Technique for Automated Tracing of Printed Circuit Board Interconnections of Electronic Devices

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