2014 International Test Conference 2014
DOI: 10.1109/test.2014.7035329
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IC laser trimming speed-up through wafer-level spatial correlation modeling

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Cited by 6 publications
(3 citation statements)
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“…Such methods can be differentiated as static and dynamic ones. Static calibration methods are represented mainly by trimming, where laser or current blown fuses are used [28]. Dynamic calibration methods include, for example, the chopper stabilization [29], auto-zeroing [30] or digital calibration [31].…”
Section: Calibration Techniquesmentioning
confidence: 99%
“…Such methods can be differentiated as static and dynamic ones. Static calibration methods are represented mainly by trimming, where laser or current blown fuses are used [28]. Dynamic calibration methods include, for example, the chopper stabilization [29], auto-zeroing [30] or digital calibration [31].…”
Section: Calibration Techniquesmentioning
confidence: 99%
“…A representative description of calibration methods for performance improvement can be found in [3] and [4]. Different techniques for trim optimizations are proposed in [5] and [6]. These involve optimizations for search of one trim code within the DUT and as well as across DUTs.…”
Section: Introductionmentioning
confidence: 99%
“…[5] focuses on the former, using smarter search methods, onchip measurement and parallelism. [6] focuses on the latter, using wafer level spatial correlation and verniered (coarse and fine) trims across neighboring dies. However, there are no specific methods reported in the literature which optimize trims for interdependent parameters.…”
Section: Introductionmentioning
confidence: 99%