ICEM: a new standard for EMC of IC definition and examples

Abstract

The ICEM standard (Integrated Circuit Electromagnetic Modei) was proposed by the French standard committee (UTE) where many semi-conductor manufacturers and final users are involved. The ICEM standard proposal is nowadays registered as a Technical Report (IEC62014-3). h the first part of this paper, the authors will present the architecture of the model. In the second part. they will describe different methods to characterize the parameters of the model. Finally, comparisons between measurement and simulation results highlight the capability of this approach for the prediction of the electromagnetic emission of an IC.

Dedicated computational models for the electromagnetic emissions of integrated circuits

“…The first is the Internal Activity (IA) submodel which describes the internal currents flowing in the IC. It resumes the contribution of all the internal blocks (analog, digital and I/O structures) on the current circulating between the power supply pins of the IC [15]. Typically, the IA submodel is a current source that can either be expressed in the time domain or in the frequency domain.…”

“…They can be represented by either lumped electrical elements such as resistance, inductance and capacitance or transmission-line models [13]. These passive elements are determined by contributions from as well the component (junction capacitance, oxide capacitance, metal capacitance, interconnection resistance and inductance) as the package (resistance and capacitance of the leads, the bonding, capacitance between the pins of the package) [15]. There are two ways to generate these sub-models.…”

“…The second approach uses measurement tools such as a network analyser, a time domain reflectometer, a scope or a fast Fourier transform process. It relies on these measurements in order to extract the impedance of the power network and the internal current consumed on the die [14] [15]. This basic ICEM model can be extended with a substrate network model in order to take substrate effects into account.…”

Development and validation of a microcontroller model for EMC

“…One method for better understanding the impact of ICs on EMC is through models of the power delivery network like the ICEM or LECCS specifications [1,2]. Previous research has shown the promise of these models in several scenarios, including prediction of the conducted emissions from ICs [3,4], of clock jitter [3], of the influence of decoupling capacitors on conducted emissions [3][4][5], and of substrate noise in mixed-signal designs [6].…”

“…Models of the IC may be obtained either through measurement or by using IC development tools that can extract resistive, capacitive and inductive values associated with the IC core and package, as well as the time-domain current consumed by the core [3][4][5][6][7]. Models of the PCB are typically found through measurement or are only predicted at low frequencies, though methods of predicting the high-frequency impedance characteristics of PCBs are available [8].…”