Ideal: A promising diamond-silicon carbide composite for enhanced ceramic armor

Shevchenko, V. Ya; Dolgin, A.S.; Sychov, M.M.; Makogon, A.I.; Perevislov, S.N.

doi:10.1016/j.ceramint.2023.10.129

Cited by 6 publications

(2 citation statements)

References 31 publications

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“…SiC ceramics are widely used in armor materials of protective equipment such as tanks and armored vehicles because of their high temperature resistance, high hardness, high compressive strength, and strong oxidation resistance [1,2]. However, SiC ceramics have low ductility and poor toughness, and are easily broken when impacted.…”

Section: Introductionmentioning

confidence: 99%

Research on the Capillary Filling Behavior of Liquid Solder Al-12Si under the Action of Electromagnetic Ultrasonic Wave

Chen,

Gao,

Zhang

et al. 2024

Applied Sciences

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To address the issues of high cost, low welding efficiency, and complex processes in vacuum brazing, we proposed a method of electromagnetic ultrasonic (EU)-assisted brazing with Al-12Si solder to join SiC ceramic and TC4 alloy. The results showed that the maximum magnetic induction strength (MIS) on the surface of the liquid solder was 0.629 T when subjected to a static and alternating magnetic field (MF). Additionally, the combined action of MF and eddy current generated a downward Lorentz force (LF) in the liquid solder, with the maximum LF in the horizontal and vertical directions being 48.91 kN m−3 and 60.93 kN m−3, respectively. Under the influence of an EU wave, the liquid solder exhibited capillary filling (CF) behavior. At 26 ms, the maximum length of CF was 12.21 mm.

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Section: Introductionmentioning

confidence: 99%

Research on the Capillary Filling Behavior of Liquid Solder Al-12Si under the Action of Electromagnetic Ultrasonic Wave

Chen,

Gao,

Zhang

et al. 2024

Applied Sciences

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“…Compared to metal and polymer materials, ceramic materials possess several advantages, including a high hardness, high mechanical strength, low density, high melting point, excellent biocompatibility, and chemical stability. Consequently, ceramic materials hold significant promise for applications in aerospace [ 1 , 2 , 3 ], weaponry [ 4 , 5 , 6 ], biomedicine [ 7 , 8 , 9 ], and other fields. The rapid development of these sectors necessitates ceramic components with more intricate shapes and finer structures to achieve objectives like further weight reduction and enhanced load-bearing capacity [ 10 , 11 ].…”

Section: Introductionmentioning

confidence: 99%

How to Improve the Curing Ability during the Vat Photopolymerization 3D Printing of Non-Oxide Ceramics: A Review

Gao,

Chen,

Chen

et al. 2024

Materials

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Vat photopolymerization (VP), as an additive manufacturing process, has experienced significant growth due to its high manufacturing precision and excellent surface quality. This method enables the fabrication of intricate shapes and structures while mitigating the machining challenges associated with non-oxide ceramics, which are known for their high hardness and brittleness. Consequently, the VP process of non-oxide ceramics has emerged as a focal point in additive manufacturing research areas. However, the absorption, refraction, and reflection of ultraviolet light by non-oxide ceramic particles can impede light penetration, leading to reduced curing thickness and posing challenges to the VP process. To enhance the efficiency and success rate of this process, researchers have explored various aspects, including the parameters of VP equipment, the composition of non-oxide VP slurries, and the surface modification of non-oxide particles. Silicon carbide and silicon nitride are examples of non-oxide ceramic particles that have been successfully employed in VP process. Nonetheless, there remains a lack of systematic induction regarding the curing mechanisms and key influencing factors of the VP process in non-oxide ceramics. This review firstly describes the curing mechanism of the non-oxide ceramic VP process, which contains the chain initiation, chain polymerization, and chain termination processes of the photosensitive resin. After that, the impact of key factors on the curing process, such as the wavelength and power of incident light, particle size, volume fraction of ceramic particles, refractive indices of photosensitive resin and ceramic particles, incident light intensity, critical light intensity, and the reactivity of photosensitive resins, are systematically discussed. Finally, this review discusses future prospects and challenges in the non-oxide ceramic VP process. Its objective is to offer valuable insights and references for further research into non-oxide ceramic VP processes.

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Interfacial microstructure of diamond/SiC composites fabricated by Si infiltration with gas flow guidance

Zhu,

Zhang,

Bao

et al. 2024

Ceramics International

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Ideal: A promising diamond-silicon carbide composite for enhanced ceramic armor

Cited by 6 publications

References 31 publications

Research on the Capillary Filling Behavior of Liquid Solder Al-12Si under the Action of Electromagnetic Ultrasonic Wave

Research on the Capillary Filling Behavior of Liquid Solder Al-12Si under the Action of Electromagnetic Ultrasonic Wave

How to Improve the Curing Ability during the Vat Photopolymerization 3D Printing of Non-Oxide Ceramics: A Review

Interfacial microstructure of diamond/SiC composites fabricated by Si infiltration with gas flow guidance

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