2013
DOI: 10.1007/s12289-013-1144-9
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Identification of non uniform thermal contact resistance in automated tape placement process

Abstract: International audienceIn this work focussing on the thermal modeling of the automated tape placement process applied to thermoplastic material, we study the thermal properties of the ply interfaces during in-situ consolidation. Through the comparison of experimental measurements and numerical simulations, we show that it is necessary to consider the existence of an interply thermal contact resistance (TCR). Furthermore, we show that in order to correctly predict the measured temperatures, the value of the ther… Show more

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Cited by 15 publications
(10 citation statements)
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“…At the interface level, a heat flux is applied, coming from the laser and acting at the substrate / incoming tape interface. Moreover, thermal conduction between the different plies constituting the substrate is affected from a contact thermal resistance as discussed in our former works [1,2,6].…”
Section: High-resolution Thermal Analysismentioning
confidence: 95%
See 1 more Smart Citation
“…At the interface level, a heat flux is applied, coming from the laser and acting at the substrate / incoming tape interface. Moreover, thermal conduction between the different plies constituting the substrate is affected from a contact thermal resistance as discussed in our former works [1,2,6].…”
Section: High-resolution Thermal Analysismentioning
confidence: 95%
“…1. During these three stages, different physical phenomena occur, all them taking place at the tapesubstrate interface and are governed by temperature and pressure evolutions [1].…”
Section: Introductionmentioning
confidence: 99%
“…The cohesion of two thermoplastic layers requires specific physical conditions: intimate contact and a temperature that is high enough to enable molecular diffusion but low enough for avoiding thermal degradation. The last two conditions acting in opposite directions on the heating process define the process window [2].…”
Section: Introductionmentioning
confidence: 99%
“…Barasinski et al 17,18 measured and simulated a TP-AFP process and determined a contact resistance between the layers due to imperfect bonding. However, no laser NP heating TP-AFP machine was used.…”
Section: Introductionmentioning
confidence: 99%
“…Longer compaction phases and lower compaction forces were used. On other studies, Levy et al 20,21 used the function to model the interlayer thermal contact resistance during a laser-assisted fiber placement process with a through thickness heating principle, similar to Barasinski et al 17,18…”
Section: Introductionmentioning
confidence: 99%