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is an open access repository that collects the work of Arts et Métiers ParisTech researchers and makes it freely available over the web where possible. This is an author-deposited version published in: https://sam.ensam.eu Handle ID AbstractAutomated tape placement -ATP -is a recent manufacturing technology for composite materials. Therefore, a correct modeling of the multi-physical process is critical in order to make possible in-situ consolidation. In this work, we propose an accurate modelling framework and an efficient simulation procedure of physics occurring during the process with the aim of studying the influence of material and process parameters into the material consolidation evolution. For that purpose, an accurate description of the prepreg surface becomes compulsory, justifying the use of a multi-resolution description of it based on the use of wavelets.

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International audienceIn this work focussing on the thermal modeling of the automated tape placement process applied to thermoplastic material, we study the thermal properties of the ply interfaces during in-situ consolidation. Through the comparison of experimental measurements and numerical simulations, we show that it is necessary to consider the existence of an interply thermal contact resistance (TCR). Furthermore, we show that in order to correctly predict the measured temperatures, the value of the thermal resistance has to evolve along the process although a very simple evolution law is sufficient