Identification of RC networks by deconvolution: chances and limits

Székely, V.

doi:10.1109/81.662698

Cited by 228 publications

(121 citation statements)

References 8 publications

Supporting

Mentioning

120

Contrasting

Unclassified

Order By: Relevance

“…The originality of the present research is proved by the fact that only a few papers on related topics could be found in the literature [2]. The most interesting result is that the impedance plot turned out to be circular graphs.…”

Section: Introductionmentioning

confidence: 77%

Thermal impedance plots of micro-scaled devices

Vermeersch

Mey

2006

Microelectronics Reliability

View full text Add to dashboard Cite

show abstract

Section: Introductionmentioning

confidence: 77%

Thermal impedance plots of micro-scaled devices

Vermeersch

Mey

2006

Microelectronics Reliability

View full text Add to dashboard Cite

show abstract

“…The calculated complex thermal impedance can be represented in a form of Nyquist plots [3]. As presented in figure 6 the plots show two fairly clearly formed semi-circles with the third one protruding between the two.…”

Section: Fig 4 Er28 Core Output Inductor (Thermal and Visual Image)mentioning

confidence: 99%

“…10.21611/qirt.2016.053 The time constant spectrum (figure 7) can be obtained by deconvolution from the complex thermal impedance [3]. Although the plot appears to shows two time constants it has to be concluded that the time constants T2 and T3 corresponding to the frequencies ω2, ω3 are either represented by a single wide-base peak due to the fact that they are closely spaced or the middle one is not shown in the spectrum.…”

Section: Fig 4 Er28 Core Output Inductor (Thermal and Visual Image)mentioning

confidence: 99%

Thermographic measurement and thermal modelling of air gap inductors in H-F power forward converters

Kasikowski¹,

Więcek²,

Farrer³

2016

Proceedings of the 2016 International Conference on Quantitative InfraRed Thermography

View full text Add to dashboard Cite

This paper examines the impact of the fringing field of an air gap on temperature distribution in the windings of output inductors in high-frequency forward converters. For this aim, a DC-DC H-F forward converter and a centre-gapped ferrite core inductor were constructed and the measurements of thermal characteristics were performed using dynamic, time-dependent thermographic analysis. The objective of this research was to consider how the length of an air gap affects the temperature distribution and power loss in the windings of output inductors in H-F forward converters.

show abstract

“…Finite element or finite difference methods are common numerical procedures in studying heat transfer problems in electronic devices [7], [8]. Resistance models [9], eigenfunction related methods [10], [11] and the deconvolution method [12] have also been applied to the analysis of thermal networks. Such numerical schemes create a discretized model that is an approximation of the actual thermal problem.…”

Section: Introductionmentioning

confidence: 99%

Interconnection of Subsystem Reduced-Order Models in the Electrothermal Analysis of Large Systems

Mathai

Shapiro

2007

IEEE Trans. Comp. Packag. Technol.

View full text Add to dashboard Cite

Abstract-Heat conduction in an electronic device is commonly modeled as a discretized thermal system (eg, finite element or finite difference models) that typically uses large matrices for solving complex problems. The large size of electronic-system heat transfer models can be reduced using model reduction methods and the resulting reduced-order models can yield accurate results with far less computational costs. Electronic devices are typically composed of components, like chips, printed circuit boards, and heat sinks that are coupled together. There are two ways of creating reduced-order models for devices that have many coupled components. The first way is to create a single reduced-order model of the entire device. The second way is to interconnect reduced-order models of the components that constitute the device. The second choice (which we call the "reduce then interconnect" approach) allows the heat transfer specialist to perform quick simulations of different architectures of the device by using a library of reduced-order models of the different components that make up the device. However, interconnecting reduced-order models in a straightforward manner can result in unstable behavior. The purpose of this paper is two-fold: creating reduced-order models of the components using a Krylov subspace algorithm and interconnecting the reducedorder models in a stable manner using concepts from control theory. In this paper we explain the logic behind the "reduce then interconnect" approach, formulate a control-theoretic method for it, and finally exhibit the whole process numerically, by applying it to an example heat conduction problem.

show abstract

Identification of RC networks by deconvolution: chances and limits

Cited by 228 publications

References 8 publications

Thermal impedance plots of micro-scaled devices

Thermal impedance plots of micro-scaled devices

Thermographic measurement and thermal modelling of air gap inductors in H-F power forward converters

Interconnection of Subsystem Reduced-Order Models in the Electrothermal Analysis of Large Systems

Contact Info

Product

Resources

About