2007
DOI: 10.1109/tcapt.2007.898368
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Interconnection of Subsystem Reduced-Order Models in the Electrothermal Analysis of Large Systems

Abstract: Abstract-Heat conduction in an electronic device is commonly modeled as a discretized thermal system (eg, finite element or finite difference models) that typically uses large matrices for solving complex problems. The large size of electronic-system heat transfer models can be reduced using model reduction methods and the resulting reduced-order models can yield accurate results with far less computational costs. Electronic devices are typically composed of components, like chips, printed circuit boards, and … Show more

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Cited by 5 publications
(6 citation statements)
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“…There are many types of reduced-order models that are possible [1][2][3][4][5]. Reduced-order models have been developed using statistical techniques [6][7][8][9][10]. Reduced-order models for the finite-volume method of heat transfer analysis have been developed by Astrid [11].…”
Section: Introductionmentioning
confidence: 99%
“…There are many types of reduced-order models that are possible [1][2][3][4][5]. Reduced-order models have been developed using statistical techniques [6][7][8][9][10]. Reduced-order models for the finite-volume method of heat transfer analysis have been developed by Astrid [11].…”
Section: Introductionmentioning
confidence: 99%
“…There exist various model reduction methods for dynamical systems; see [5,6] and references therein. However, model order reduction of coupled systems as well as stability and accuracy issues related to the coupling of the reducedorder subsystems received only little attention [7,8].…”
Section: Introductionmentioning
confidence: 99%
“…The first question that will be addressed in this paper is the stability theory for coupled systems. Based on work [10], we will propose sufficient conditions for the closed-loop descriptor system (6), (7) to be asymptotically stable.…”
Section: Introductionmentioning
confidence: 99%
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