IMC Growth and Mechanical Properties of Cu/In-48Sn/Cu Solder Joints

Liu, Zheng; Li, Yang; Lü, Kai; Zhang, Yao Cheng; Yu, Xu; Xu, Feng; Gao, Hui

doi:10.1007/s11664-021-08844-5

Cited by 9 publications

(3 citation statements)

References 20 publications

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“…In detail, only needle-like Cu 6 (In,Sn) 5 formed at the shorter soldering time, as shown in Figure 10a,e. With an extension in soldering time, the needle-like Cu 6 (In,Sn) 5 transformed into rod-like Cu 6 (In,Sn) 5 of polyhedron-type [36]. Finally, the IMC changed to a tube-like morphology with a core, as shown in Figure 10d.…”

Section: Growth Kinetics Of the Interfacial Imc Layermentioning

confidence: 96%

Identification and Evolution of Intermetallic Compounds Formed at the Interface between In-48Sn and Cu during Liquid Soldering Reactions

Shang,

Tian,

Liu

2024

Metals

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It is difficult to confirm the existence of intermetallic compounds (IMCs) between SnIn and Cu, as their atomic numbers are very close, making it challenging to differentiate them through experimental tests. In order to determine IMCs and understand their growth mechanism, this study employed phase identification, morphology observation, and growth kinetics analyses on IMCs formed between In-48Sn solder and polycrystalline Cu substrate during liquid soldering. The experiments were conducted within a temperature range of 160~250 °C for up to 90 min. The obtained results indicated that IMCs formed at the interface depended strongly on the soldering temperature. During long-time soldering below 200 °C, one main IMC species, Cu2(In,Sn), was found at the In-48Sn solder/Cu interface, which showed two different morphologies: a coarse-grained layer at the solder side and a fine-grained layer within the Cu component. When the soldering temperature was increased to 200 °C, Cu6(In,Sn)5 was the only intermetallic compound (IMC) that formed at the point where the In-48Sn/Cu eutectic interface existed. At 250 °C, with an increase in the soldering time, there was a formation of Cu9(In,Sn)4 between Cu and Cu6(In,Sn)5. The growth kinetics analyses indicated that the fast grain boundary/molten-channel diffusion of Cu into solder and their reaction with solder controlled the growth of the interfacial IMCs, with the activation energy of 24.56 kJ/mol when the sample was liquid-state-aged above 200 °C.

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Section: Growth Kinetics Of the Interfacial Imc Layermentioning

confidence: 96%

Identification and Evolution of Intermetallic Compounds Formed at the Interface between In-48Sn and Cu during Liquid Soldering Reactions

Shang,

Tian,

Liu

2024

Metals

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“…Therefore, In-based solders with low melting temperatures have been essentially used for soldering [26,27]. However, the interface between the In-based solder and the Cu UBM is a layer of Cu-In intermetallic compounds, not Cu-Sn IMC [28][29][30]. The interfacial reaction between the solder and UBM is controlled by their inter-diffusion.…”

Section: Introductionmentioning

confidence: 99%

Void-free interface between in and high-impurity Cu joint

Lee,

Shen,

Chen

2023

Science and Technology of Welding and Joining

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The effect of impurities in the Cu film on the void formation at the interface of the Sn-rich solder joint has been extensively studied. However, this has rarely been studied for In solder joints. In this study, Sn-3.0Ag-0.5Cu (SAC305) and In-solder/ Cu films with high impurities were aged at 150 °C to analyze the films at various aging times. A metastable CuIn 2 phase appeared and transformed into a stable Cu 11 In 9 phase. Noticeable voids and cracks were observed at the SAC305/Cu interface during the solid-state aging. In contrast, there was a void-free interface between In and Cu-CP. This was primarily due to the difference in diffusion behaviour between In/Cu and SAC305/Cu. The mechanism of the above phenomenon was revealed.

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“…It has been proposed that recrystallisation within the γ-InSn 4 phase might occur during shear testing and result in strain softening [ 5 ]. The eutectic alloy In-48Sn has attracted attention due to it having the lowest melting point (118 °C) in the In-Sn system [ 14 , 15 , 16 , 17 ]. An average UTS of 13 MPa with 34% elongation for In-48Sn solder at room temperature has been reported in early studies [ 11 , 18 ], and failure by intergranular cracking and cleavage between the β and γ phases has been reported [ 18 ].…”

Section: Introductionmentioning

confidence: 99%

Mechanical Properties and Microstructure of Binary In-Sn Alloys for Flexible Low Temperature Electronic Joints

et al. 2022

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This research evaluates the mechanical properties of a variety of binary In-Sn alloys as potential candidates for low temperature electronic joints. The tensile and hardness tests of as-cast In-5Sn, In-12.5Sn, In-25Sn, In-30Sn, In-35Sn, In-40Sn, In-50Sn, In-60Sn, In-80Sn (wt.%) were assessed at room temperature and compared to those of pure In and Sn. The ultimate tensile strength (UTS) increased from 4.2 MPa to 37.8 MPa with increasing tin content in the alloys under the testing condition of 18 mm/min and the results showed little difference under a lower strain rate (1.8 mm/min). Most compositions showed good ductility in tensile testing with an average of 40% elongation. A melting point range of 119.3 °C to 194.9 °C for tested alloys was measured using differential scanning calorimetry (DSC). The microstructure investigated by scanning electron microscopy (SEM) was discussed with respect to the mechanical properties and it has been found that the presence of the Sn-rich γ-InSn4 phase in the microstructure has a significant impact on mechanical properties. The fundamental data from this study can be used for the development of new low temperature In-Sn alloys.

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IMC Growth and Mechanical Properties of Cu/In-48Sn/Cu Solder Joints

Cited by 9 publications

References 20 publications

Identification and Evolution of Intermetallic Compounds Formed at the Interface between In-48Sn and Cu during Liquid Soldering Reactions

Identification and Evolution of Intermetallic Compounds Formed at the Interface between In-48Sn and Cu during Liquid Soldering Reactions

Void-free interface between in and high-impurity Cu joint

Mechanical Properties and Microstructure of Binary In-Sn Alloys for Flexible Low Temperature Electronic Joints

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